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Texas Instruments, Inc. PCN#20170613005
PCN Number:
20170613005
PCN Date:
June 27, 2017
Title:
Qualification of Hefei Tongfu Microelectronic Co. Ltd (HFTF) as additional Assembly and
Test Site for Select Devices
Customer Contact:
PCN Manager
Quality Services
Proposed 1
st
Ship Date:
Sept 27, 2017
Estimated Sample
Availability:
Date provided at
sample request
Change Type:
Assembly Site
Design
Wafer Bump Site
Assembly Process
Data Sheet
Wafer Bump Material
Assembly Materials
Part number change
Wafer Bump Process
Mechanical Specification
Test Site
Wafer Fab Site
Packing/Shipping/Labeling
Test Process
Wafer Fab Materials
Wafer Fab Process
PCN Details
Description of Change:
Texas Instruments is pleased to announce the Qualification of Hefei Tongfu Microelectronic Co. Ltd
(HFTF) as additional Assembly and Test Site for Select Devices listed in the “Product Affected”
Section. Current assembly sites and Material differences are as follows.
Assembly Site
Assembly Site Origin
Assembly Country Code
Assembly Site City
NFME
NFM
CHN
Chongchuan
HFTF
HFT
CHN
Hefei
Material Differences:
NFME
HFTF
Mold compound
R-07
R-27
Test coverage, insertions, conditions will remain consistent with current testing and verified with
test MQ.
Reason for Change:
Continuity of supply.
Anticipated impact on Form, Fit, Function, Quality or Reliability (positive / negative):
None
Anticipated impact on Material Declaration
No Impact to the
Material Declaration
Material Declarations or Product Content reports are driven from
production data and will be available following the production
release. Upon production release the revised reports can be
obtained from the TI Eco-Info website. There is no impact to the
material meeting current regulatory compliance requirements with
this PCN change.
Changes to product identification resulting from this PCN:
Assembly Site
NFME
Assembly Site Origin (22L)
ASO: NFM
HFTF
Assembly Site Origin (22L)
ASO: HFT
Sample product shipping label (not actual product label)

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