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TPD1E05U06DPYR 产品修订记录 - TI(德州仪器)
制造商:
TI(德州仪器)
分类:
二极管
封装:
XDFN-2
描述:
TEXAS INSTRUMENTS TPD1E05U06DPYR 静电保护装置, 1通道, 14 V, X1SON, 2 引脚, 5.5 V 新
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TPD1E05U06DPYR数据手册
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Texas Instruments, Inc. PCN# 20170815000A
PCN Number:
20170815000A
PCN Date:
Sept. 6, 2017
Title:
Qualification of CIRTEK as an additional Assembly & Test site for select devices
Customer Contact:
PCN Manager
Dept:
Quality Services
Proposed 1
st
Ship Date:
Nov. 30, 2017
Estimated Sample
Availability:
Date Provided at Sample
request
Change Type:
Assembly Site
Design
Wafer Bump Site
Assembly Process
Data Sheet
Wafer Bump Material
Assembly Materials
Part number change
Wafer Bump Process
Mechanical Specification
Test Site
Wafer Fab Site
Packing/Shipping/Labeling
Test Process
Wafer Fab Materials
Wafer Fab Process
PCN Details
Description of Change:
Revision A is to announce the addition of new devices that were not included on the original PCN
notification. These new devices are highlighted and bolded under Group 2 in the device list
below. The expected first shipment date for these new devices will be 90 days from this notice for
these newly added devices only.
Texas Instruments Incorporated is announcing the qualification CIRTEK as an Additional Assembly
and Test Site for select devices listed in the “Product Affected” Section. Current assembly sites
and Material differences are as follows.
Assembly Site
Assembly Site Origin
Assembly Country Code
Assembly Site City
ASEN
ASN
CHN
Suzhou
JCET
JCE
CHN
Jiangyin
CIRTEK
CTK
PHL
Biñan
Group 1: Material Differences:
ASEN
JCET
CIRTEK
Mount compound
1400238112
120402001600
HNK6NSNC10
Mold compound
1800819111
120903003009
B8240AB16A
Group 2: Material Differences
ASEN
JCET
CIRTEK
Mount compound
1400230112
120402002600
NMS607CO10
Mold compound
1800819111
120903003009
B8240AB16A
Test coverage, insertions, conditions will remain consistent with current testing and verified with
test MQ.
Reason for Change:
Continuity of supply.
Anticipated impact on Form, Fit, Function, Quality or Reliability (positive / negative):
None
Anticipated impact on Material Declaration
No Impact to the
Material Declaration
Material Declarations or Product Content reports are driven from
production data and will be available following the production
release. Upon production release the revised reports can be
obtained from the TI Eco-Info website. There is no impact to the
material meeting current regulatory compliance requirements
with this PCN change.
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