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器件3D模型￥ 11.604
TSZ124IPT 其他数据使用手册 - ST Microelectronics（意法半导体）
制造商:
ST Microelectronics（意法半导体）
分类:
放大器、缓冲器
封装:
TSSOP-14
描述:
运算放大器, 轨至轨输入, 4个放大器, 400 kHz, 0.19 V/µs, 1.8V 至 5.5V, TSSOP, 14 引脚
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
典型应用电路图在P27P31
功能描述在P5P6P7P27P31P32P42P43P50P51P53
应用领域在P4P15P27P29P31P53
型号编号列表在P31
导航目录
TSZ124IPT数据手册
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Content
Introduction ............................................................................... 3
More efficient ............................................................................ 4
Motor drivers
.................................................................................. 4
Gate drivers
.................................................................................... 7
IGBTs and Power MOSFETs
.............................................................. 8
Diodes and SiC rectiers
............................................................... 11
SiC MOSFETs
................................................................................. 12
Intelligent power modules
............................................................ 13
Thyristors and AC switches
............................................................ 14
AC/DC and DC/DC regulators
..................................................... 17
Power management ICs
.............................................................. 20
More Intelligent & Aware .................................................. 22
MCUs
........................................................................................... 23
STM32-SafeSIL
............................................................................... 27
Widest portfolio of RTC offers unlimited design solutions
............... 31
Signal conditioning
...................................................................... 33
Analog and digital inputs
............................................................ 37
Intelligent power switches (IPS)
.................................................... 39
Isolation
....................................................................................... 41
Motion MEMS
............................................................................... 42
Environmental sensors
.................................................................. 43
Focus on the new STM32 NUCLEO expansion board for sensors
.. 43
More connected ..................................................................... 46
IO-Link
.......................................................................................... 46
Fieldbus
........................................................................................ 48
Wi-Fi modules
............................................................................... 50
Bluetooth
...................................................................................... 50
Sub-1GHz
...................................................................................... 52
NFC and RFID
............................................................................... 54
ESD & EMI protection
.................................................................... 55
Proximity sensor protection
........................................................... 57
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