Datasheet 搜索 > 地磁传感器 > ST Microelectronics（意法半导体） > LIS3MDLTR 数据手册 > LIS3MDLTR 产品设计参考手册 4/9 页
器件3D模型￥ 5.221
LIS3MDLTR 产品设计参考手册 - ST Microelectronics（意法半导体）
制造商:
ST Microelectronics（意法半导体）
分类:
地磁传感器
封装:
LGA-12
描述:
STMICROELECTRONICS LIS3MDLTR 模块, MEMS, 三轴磁强计, 1.9 V, 3.6 V, LGA, 12 引脚
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LIS3MDLTR数据手册
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PCB design guidelines TN0018
4/9 DocID12707 Rev 6
2 PCB design guidelines
PCB land and solder mask general recommendations are shown in Figure 1. Refer to the
device datasheet for pad count, size and pitch.
It is recommended to open the solder mask external to the PCB land;
It is strongly recommended not to place any structure on the top metal layer
underneath the sensor (on the same side of the board). This must be defined as a
keepout area.
Traces connected to pads should be as much symmetric as possible. Symmetry and
balance for pad connection will help component self-alignment and will lead to better
control of solder paste reduction after reflow;
For optimal performance of the device, it is strongly recommended to place screw
mounting holes at a distance greater than 2 mm from the sensor.
If present, the pin #1 indicator must be left unconnected to ensure proper device
functionality.
In order to prevent noise coupling and thermo-mechanical stress, following standard
industry design practices for component placement is advised.
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