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REF3212AMDBVREPG4 产品设计参考手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
电压基准芯片
封装:
SOT-23
描述:
4 PPM100采用SOT23-6串联电压基准 4 ppm100 A SOT23-6 SERIES VOLTAGE REFERENCES
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P3Hot
典型应用电路图在P15
原理图在P10
封装尺寸在P2P18
型号编码规则在P2
标记信息在P2
封装信息在P2P18P19
功能描述在P3
技术参数、封装参数在P3
应用领域在P1P4P21
电气规格在P4P5P11P13
导航目录
REF3212AMDBVREPG4数据手册
Page:
of 21 Go
若手册格式错乱，请下载阅览PDF原文件
1
GND_F
GND_S
3
2
ENABLE
5
6
4
OUT_S
IN
OUT_F
R3 2 x
SOT23-6
(TOP VIEW)
REF3212-EP, REF3220-EP, REF3225-EP
REF3230-EP, REF3233-EP, REF3240-EP
www.ti.com
SBVS078B –OCTOBER 2006– REVISED AUGUST 2011
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
Figure 1. PIN CONFIGURATION
A. The location of pin 1 on the REF32xx is determined by orienting the package marking as shown.
PIN DESCRIPTIONS
PIN
NAME NO. FUNCTION DESCRIPTION
ENABLE 3 Digital input This pin enables and disables the device
GND_F 1 Analog output Ground connection of the device
GND_S 2 Analog input Ground sense at the load
IN 4 Analog input Positive supply voltage
OUT_F 6 Analog output Output of Reference Voltage
OUT_S 5 Analog input Sense connection at the load
Absolute Maximum Ratings
(1)
MIN MAX UNIT
Input voltage 7.5 V
Output short-circuit Continuous
Operating temperature range –55 125 °C
Storage temperature range –65 150
(2)
°C
Junction temperature 150 °C
Human-Body Model 4
kV
ESD rating Charged-Device Model 1
Machine Model 400 V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
(2) Long-term high-temperature storage and/or extended use at maximum recommended operating conditions may result in a reduction of
overall device life. See http://www.ti.com/ep_quality for additional information on enhanced plastic packaging.
Copyright © 2006–2011, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): REF3212-EP, REF3220-EP, REF3225-EP REF3230-EP, REF3233-EP, REF3240-EP
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