Datasheet 搜索 > 微控制器 > NXP（恩智浦） > MC9S08AW60CFGER 数据手册 > MC9S08AW60CFGER 用户编程技术手册 1/339 页
器件3D模型￥ 65.238
MC9S08AW60CFGER 用户编程技术手册 - NXP（恩智浦）
制造商:
NXP（恩智浦）
分类:
微控制器
封装:
LQFP-44
描述:
其他系列 40MHz 60K@x8bit 2KB
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P27P28P29P30P31P32P33P34P35P36P69P83Hot
典型应用电路图在P24P129
原理图在P22P23P84P89P130P133P141P156P157P162P167P168
封装尺寸在P1P323
型号编码规则在P321P322P323P337
功能描述在P132P139P159P179P193P203P204P205P222P237P260
技术参数、封装参数在P79P129P211P295P296P297P298P299P300P301P302P303
应用领域在P199
电气规格在P79P129P134P211P295P296P297P298P299P300P301P302
导航目录
MC9S08AW60CFGER数据手册
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Freescale Semiconductor
Addendum
Document Number: QFN_Addendum
Rev. 0, 07/2014
© Freescale Semiconductor, Inc., 2014. All rights reserved.
This addendum provides the changes to the 98A case outline numbers for products covered in this book.
Case outlines were changed because of the migration from gold wire to copper wire in some packages. See
the table below for the old (gold wire) package versus the new (copper wire) package.
To view the new drawing, go to Freescale.com and search on the new 98A package number for your
device.
For more information about QFN package use, see EB806: Electrical Connection Recommendations for
the Exposed Pad on QFN and DFN Packages.
Addendum for New QFN
Package Migration
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