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器件3D模型￥ 5.826
74LVT16245BDGGRG4 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
逻辑控制器
封装:
TSSOP-48
描述:
3.3 -V ABT 16位总线，三态输出收发器 3.3-V ABT 16-BIT BUS TRANSCEIVERS WITH 3-STATE OUTPUTS
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74LVT16245BDGGRG4数据手册
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of 20 Go
若手册格式错乱，请下载阅览PDF原文件
www.ti.com
FEATURES
SN54LVT16245B. . . WD PACKAGE
SN74LVT16245B. . . DGG, DGV, OR DL PACKAGE
(TOP VIEW)
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1DIR
1B1
1B2
GND
1B3
1B4
V
CC
1B5
1B6
GND
1B7
1B8
2B1
2B2
GND
2B3
2B4
V
CC
2B5
2B6
GND
2B7
2B8
2DIR
1OE
1A1
1A2
GND
1A3
1A4
V
CC
1A5
1A6
GND
1A7
1A8
2A1
2A2
GND
2A3
2A4
V
CC
2A5
2A6
GND
2A7
2A8
2OE
DESCRIPTION/ORDERING INFORMATION
SN54LVT16245B , , SN74LVT16245B
3.3-V ABT 16-BIT BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCBS715E – FEBRUARY 2000 – REVISED NOVEMBER 2006
• Member of the Texas Instruments Widebus™
Family
• State-of-the-Art Advanced BiCMOS
Technology (ABT) Design for 3.3-V Operation
and Low Static-Power Dissipation
• Support Mixed-Mode Signal Operation
(5-V Input and Output Voltages With
3.3-V V
CC
)
• Support Unregulated Battery Operation Down
to 2.7 V
• Typical V
OLP
(Output Ground Bounce) <0.8 V
at V
CC
= 3.3 V, T
A
= 25 ° C
• I
off
and Power-Up 3-State Support Hot
Insertion
• Distributed V
CC
and GND Pins Minimize
High-Speed Switching Noise
• Flow-Through Architecture Optimizes PCB
Layout
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
ORDERING INFORMATION
T
A
PACKAGE
(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING
FBGA – GRD SN74LVT16245BGRDR
Reel of 1000 VD245B
FBGA – ZRD (Pb-free) SN74LVT16245BZRDR
SN74LVT16245BDL
Tube of 25
SN74LVT16245BDLG4
SSOP – DL LVT16245B
SN74LVT16245BDLR
Reel of 1000
74LVT16245BDLRG4
–40 ° C to 85 ° C
SN74LVT16245BDGGR
TSSOP – DGG Reel of 2000 LVT16245B
74LVT16245BDGGRE4
SN74LVT16245BDGVR
TVSOP – DGV Reel of 2000 VD245B
74LVT16245BDGVRE4
VFBGA – GQL SN74LVT16245BGQLR
Reel of 1000 VD245B
VFBGA – ZQL (Pb-free) SN74LVT16245BZQLR
–55 ° C to 125 ° C CFP – WD Tube SNJ54LVT16245BWD SNJ54LVT16245BWD
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus is a trademark of Texas Instruments.
UNLESS OTHERWISE NOTED this document contains
Copyright © 2000–2006, Texas Instruments Incorporated
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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