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器件3D模型￥ 1029.059
A42MX16-3VQ100 数据手册 - Microsemi（美高森美）
制造商:
Microsemi（美高森美）
分类:
FPGA芯片
封装:
TQFP-100
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P18P20P88P90P91P92P94P96P98P100P102P104Hot
型号编码规则在P2P146
封装信息在P2P148
功能描述在P1P6P147
技术参数、封装参数在P22P23P24P25P26P27P28P29P146P148
电气规格在P23P25P27P146P148
导航目录
A42MX16-3VQ100数据手册
Page:
of 150 Go
若手册格式错乱，请下载阅览PDF原文件
40MX and 42MX FPGA Families
Revision 13 ii
Ordering Information
Plastic Device Resources
Device
User I/Os
PLCC
44-Pin
PLCC
68-Pin
PLCC
84-Pin
PQFP
100-Pin
PQFP
144-Pin
PQFP
160-Pin
PQFP
208-Pin
PQFP
240-Pin
VQFP
80-Pin
VQFP
100-Pin
TQFP
176-Pin
PBGA
272-Pin
A40MX02 34 57 – 57 – – – – 57 – – –
A40MX04 34 57 69 69 – – – – 69 – – –
A42MX09 – – 72 83 95 101 – – – 83 104 –
A42MX16 – – 72 83 – 125 140 – – 83 140 –
A42MX24 – – 72 – – 125 176 – – – 150 –
A42MX36 – – – – – – 176 202 – – – 202
Note: Package Definitions
PLCC = Plastic Leaded Chip Carrier, PQFP = Plastic Quad Flat Pack, TQFP = Thin Quad Flat Pack, VQFP = Very Thin Quad
Flat Pack, PBGA = Plastic Ball Grid Array
_
Part Number
Speed Grade
Package Type
Package Lead Count
Lead-Free Packaging
Blank = Standard Packaging
G = RoHS Compliant Packaging
Blank = Commercial (0 to +70°C)
Application (Temperature Range)
PL = Plastic Leaded Chip Carrier
CQ =Ceramic Quad Flat Pack
BG = Plastic Ball Grid Array
VQ = Very Thin (1.0 mm) Quad Flat Pack
TQ = Thin (1.4 mm) Quad Flat Pack
PQ = Plastic Quad Flat Pack
Blank = Standard Speed
–1 = Approximately 15% Faster than Standard
–2 = Approximately 25% Faster than Standard
–3 = Approximately 35% Faster than Standard
–F = Approximately 40% Slower than Standard
A40MX02 = 3,000 System Gates
A40MX04 = 6,000 System Gates
A42MX09 = 14,000 System Gates
A42MX16 = 24,000 System Gates
A42MX24 = 36,000 System Gates
A42MX36 = 54,000 System Gates
A42MX16
1
PQ 100
G
ES
I = Industrial (–40 to +85°C)
M = Military (–55 to +125°C)
A = Automotive (–40 to +125°C)
B = MIL-STD-883
PG =Ceramic Pin Grid Array
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