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AD5270BRMZ20 数据手册 - ADI(亚德诺)
制造商:
ADI(亚德诺)
分类:
数字电位器
封装:
MSOP
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P10P23Hot
原理图在P1
封装尺寸在P23
型号编码规则在P24
焊接温度在P9
功能描述在P1P10P23
技术参数、封装参数在P1P3P7P9P17P22
应用领域在P1
电气规格在P3P5P11
导航目录
AD5270BRMZ20数据手册
Page:
of 24 Go
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Data Sheet AD5270/AD5271
Rev. F | Page 9 of 24
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 8.
Parameter Rating
V
DD
to GND –0.3 V to +7.0 V
V
SS
to GND +0.3 V to −7.0 V
V
DD
to V
SS
7 V
V
A
, V
W
to GND V
SS
− 0.3 V, V
DD
+ 0.3 V
Digital Input and Output Voltage to GND −0.3 V to V
DD
+ 0.3 V
EXT_CAP to V
SS
7 V
I
A
, I
W
Continuous
R
AW
= 20 kΩ ±3 mA
R
AW
= 50 kΩ, 100 kΩ ±2 mA
Pulsed
1
Frequency > 10 kHz ±MCC
2
/d
3
Frequency ≤ 10 kHz ±MCC
2
/√d
3
Operating Temperature Range
4
−40°C to +125°C
Maximum Junction Temperature
(T
J
Maximum)
150°C
Storage Temperature Range −65°C to +150°C
Reflow Soldering
Peak Temperature 260°C
Time at Peak Temperature 20 sec to 40 sec
Package Power Dissipation (T
J
max − T
A
)/θ
JA
1
Maximum terminal current is bounded by the maximum current handling of
the switches, maximum power dissipation of the package, and maximum
applied voltage across any two of the A and W terminals at a given
resistance.
2
Maximum continuous current.
3
Pulse duty factor.
4
Includes programming of 50-TP memory.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or
any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is defined by JEDEC specification JESD-51 and the value is
dependent on the test board and test environment.
Table 9. Thermal Resistance
Package Type θ
JA
1
θ
JC
Unit
10-Lead LFCSP 50 3 °C/W
10-Lead MSOP 135 N/A °C/W
1
JEDEC 2S2P test board, still air (0 m/s air flow).
ESD CAUTION
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