Datasheet 搜索 > FPGA芯片 > Microsemi（美高森美） > APA300-FGG144 数据手册 > APA300-FGG144 数据手册 2/10 页
器件3D模型￥ 691.524
APA300-FGG144 数据手册 - Microsemi（美高森美）
制造商:
Microsemi（美高森美）
分类:
FPGA芯片
封装:
FBGA-144
Pictures:
3D模型
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APA300-FGG144数据手册
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若手册格式错乱，请下载阅览PDF原文件
ProASIC
PLUS
Flash Family FPGAs
ii v5.9
Ordering Information
APA1000 FG
_
Part Number
Speed Grade
Blank
=
Standard Speed
Package Type
PQ
=
Plastic Quad Flat Pack (0.5 mm pitch)
TQ
=
Thin Quad Flat Pack (0.5 mm pitch)
FG
=
Fine Pitch Ball Grid Array (1.0 mm pitch)
BG
=
Plastic Ball Grid Array (1.27 mm pitch)
CQ
=
Ceramic Quad Flat Pack (1.05 mm pitch)
CG
=
Ceramic Column Grid Array (1.27 mm pitch)
LG
=
Land Grid Array (1.27 mm pitch)
1152 I
Package Lead Count
Application (Ambient Temperature Range)
G
Lead-free packaging
Blank = Standard Packaging
G = RoHS Compliant Packaging
Blank = Commercial (0°C to +70°C)
I = Industrial (–40°C to +85°C)
PP = Pre-production
ES = Engineering Silicon (room temperature only)
M = Military (–55°C to 125°C)
B = MIL-STD-883 Class B
150,000 Equivalent System GatesAPA150 =
75,000 Equivalent System GatesAPA075 =
APA300 300,000 Equivalent System Gates=
APA450 450,000 Equivalent System Gates=
APA600 600,000 Equivalent System Gates=
APA750 750,000 Equivalent System Gates=
APA1000 1,000,000 Equivalent System Gates=
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