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BAS316,135 数据手册 - Nexperia（安世）
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Nexperia（安世）
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SOD-323
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BAS316,135数据手册
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BAS16_SER All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 6 — 24 September 2014 5 of 21
NXP Semiconductors
BAS16 series
High-speed switching diodes
6. Thermal characteristics
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB with 60 m copper strip line.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm
2
.
[4] Single diode loaded.
[5] Soldering point of cathode tab.
[6] Soldering points at pins 4, 5 and 6.
Table 7. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-a)
thermal resistance from
junction to ambient
in free air
BAS16
[1]
- - 500 K/W
BAS16H
[2]
- - 330 K/W
[3]
- - 150 K/W
BAS16J
[3]
- - 230 K/W
BAS16L
[2]
- - 500 K/W
BAS16VV
[2][4]
- - 700 K/W
[3][4]
- - 410 K/W
BAS16W
[1]
- - 625 K/W
R
th(j-sp)
thermal resistance from
junction to solder point
BAS16 - - 330 K/W
BAS16H
[5]
--70K/W
BAS16J
[5]
--55K/W
BAS16T - - 350 K/W
BAS16VY
[4][6]
- - 260 K/W
BAS16W - - 300 K/W
BAS316
[5]
- - 150 K/W
BAS516
[5]
- - 120 K/W
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