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器件3D模型￥ 3.93
CC1101RGPR 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
RF射频器件
封装:
QFN-20
描述:
TEXAS INSTRUMENTS CC1101RGPR 芯片, 射频收发器, QFN-20
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P20P34P71Hot
典型应用电路图在P25
原理图在P22
封装尺寸在P99
焊盘布局在P26
型号编码规则在P95
标记信息在P99
封装信息在P99P100
焊接温度在P8
功能描述在P2
技术参数、封装参数在P8P9P34
应用领域在P1P105
电气规格在P9
导航目录
CC1101RGPR数据手册
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若手册格式错乱，请下载阅览PDF原文件
PACKAGE OPTION ADDENDUM
www.ti.com
9-May-2015
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
CC1101RGP ACTIVE QFN RGP 20 92 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR -40 to 85 CC1101
CC1101RGPR ACTIVE QFN RGP 20 3000 Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-3-260C-168 HR -40 to 85 CC1101
CC1101RGPT ACTIVE QFN RGP 20 250 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR -40 to 85 CC1101
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
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