Datasheet 搜索 > MOS管 > Fairchild（飞兆/仙童） > FDS9945 数据手册 > FDS9945 数据手册 2/5 页
器件3D模型￥ 7.264
FDS9945 数据手册 - Fairchild（飞兆/仙童）
制造商:
Fairchild（飞兆/仙童）
分类:
MOS管
封装:
SOIC-8
描述:
FAIRCHILD SEMICONDUCTOR FDS9945.. 双路场效应管, MOSFET, 双N沟道, 3.5 A, 60 V, 100 mohm, 10 V, 2.5 V
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FDS9945数据手册
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FDS9945 Rev B(W)
Electrical Characteristics T
A
= 25°C unless otherwise noted
Symbol
Parameter Test Conditions Min Typ Max
Units
Off Characteristics
BV
DSS
Drain–Source Breakdown Voltage
V
GS
= 0 V, I
D
= 250 µA 60 V
∆BVDSS
∆T
J
Breakdown Voltage Temperature
Coefficient
I
D
= 250 µA, Referenced to 25°C 62.5 mV/°C
I
DSS
Zero Gate Voltage Drain Current V
DS
= 48 V, V
GS
= 0 V 1 µA
I
GSSF
Gate–Body Leakage, Forward V
GS
= 20 V, V
DS
= 0 V 100 nA
I
GSSR
Gate–Body Leakage, Reverse V
GS
= –20 V V
DS
= 0 V –100 nA
On Characteristics (Note 2)
V
GS(th)
Gate Threshold Voltage V
DS
= V
GS
, I
D
= 250 µA 1 2.5 3 V
∆VGS(th)
∆T
J
Gate Threshold Voltage
Temperature Coefficient
I
D
= 250 µA, Referenced to 25°C
–6 mV/°C
R
DS(on)
Static Drain–Source
On–Resistance
V
GS
= 10 V, I
D
= 3.5 A
V
GS
= 4.5V, I
D
= 2.5 A
V
GS
= 10 V, I
D
=3.5A, T
J
=125°C
74
103
126
100
200
170
mΩ
I
D(on)
On–State Drain Current V
GS
= 10 V, = V
DS
=30 V 10 A
g
FS
Forward Transconductance V
DS
= 5V, I
D
= 3.5 A 8.6 S
Dynamic Characteristics
C
iss
Input Capacitance 420 pF
C
oss
Output Capacitance 48 pF
C
rss
Reverse Transfer Capacitance
V
DS
= 30 V, V
GS
= 0 V,
f = 1.0 MHz
20 pF
Switching Characteristics (Note 2)
t
d(on)
Turn–On Delay Time 7 14 ns
t
r
Turn–On Rise Time 4.3 8.6 ns
t
d(off)
Turn–Off Delay Time 19 34 ns
t
f
Turn–Off Fall Time
V
DD
= 30 V, I
D
= 1 A,
V
GS
= 10 V, R
GEN
= 6 Ω
3 6 ns
Q
g
Total Gate Charge 8 13 nC
Q
gs
Gate–Source Charge 4 nC
Q
gd
Gate–Drain Charge
V
DS
= 30 V, I
D
= 3.5 A,
V
GS
= 5 V
2.5 nC
Drain–Source Diode Characteristics and Maximum Ratings
I
S
Maximum Continuous Drain–Source Diode Forward Current 2.1 A
V
SD
Drain–Source Diode Forward
Voltage
V
GS
= 0 V, I
S
= 2.1 A (Note 2) 0.8 1.2 V
Notes:
1. R
θJA
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. R
θJC
is guaranteed by design while R
θCA
is determined by the user's board design.
a) 78°/W when
mounted on a 0.5in
2
pad of 2 oz copper
b) 125°/W when
mounted on a 0.02
in
2
pad of 2 oz
copper
c) 135°/W when mounted on a
minimum pad.
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%
FDS9945
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