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FSA2567数据手册
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© 2008 Semiconductor Components Industries, LLC. Publication Order Number:
November-2017, Rev. 2 FSA2567/D
FSA2567 Low-Power, Dual SIM Card Analog Switch
FSA2567 Low-Power, Dual SIM Card Analog
Switch
Features
Low On Capacitance for Data Path: 10 pF Typical
Low On Resistance for Data Path: 6 Typical
Low On Resistance for Supply Path: 0.4 Typical
Wide V
CC
Operating Range: 1.65 V to 4.3 V
Low Pow er Consumption: 1 μA Maximum
- 15 μA Maximum I
CCT
Over Expanded Voltage
Range (V
IN
=1.8 V, V
CC
=4.3 V)
Wide -3 db Bandw idth: > 160 MHz
Packaged in:
- Pb-free 16-Lead MLP & 16-Lead UMLP
3 kV ESD Rating, >12 kV Pow er/GND ESD Rating
Applications
Cell phone, PDA, Digital Camera, and Notebook
LCD Monitor, TV, and Set-Top Box
Description
The FSA2567 is a bi-directional, low -power, dual double-
pole, double-throw (4PDT) analog switch targeted at dual
SIM card multiplexing. It is optimized for sw itching the
WLAN-SIM data and control signals and dedicates one
channel as a supply-source switch.
The FSA2567 is compatible w ith the requirements of SIM
cards and features a low on capacitance (C
ON
) of 10 pF
to ensure high-speed data transfer. The V
SIM
sw itch path
has a low R
ON
characteristic to ensure minimal voltage
drop in the dual SIM card supply paths.
The FSA2567 contains special circuitry that minimizes
current consumption when the control voltage applied to
the SEL pin is lower than the supply voltage (V
CC
). This
feature is especially valuable in ultra-portable applications,
such as cell phones; allowing direct interface with the
general-purpose I/Os of the baseband processor. Other
applications include switching and connector sharing in
portable cell phones, PDAs, digital cameras, printers, and
notebook computers.
Ordering Information
Part Number Top Mark
Operating
Temperature
Range
Package
FSA2567MPX FSA2567 -40 to +85°C
16-Lead, Molded Leadless Package (MLP) Quad, JEDEC MO-
220, 3 mm Square
FSA2567UMX GX
16-Lead, Quad, Ultrathin Molded Leadless Package (UMLP),
1.8 x 2.6 mm

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