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FSA2567MPX 数据手册 - ON Semiconductor（安森美）
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ON Semiconductor（安森美）
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模拟开关芯片
封装:
MLP-16
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ON Semiconductor FSA2567MPX 模拟开关, 单四刀双掷, 3 V电源, 16引脚 MLP封装
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FSA2567MPX数据手册
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© 2008 Semiconductor Components Industries, LLC. Publication Order Number:
November-2017, Rev. 2 FSA2567/D
FSA2567 — Low-Power, Dual SIM Card Analog Switch
FSA2567 — Low-Power, Dual SIM Card Analog
Switch
Features
Low On Capacitance for Data Path: 10 pF Typical
Low On Resistance for Data Path: 6 Ω Typical
Low On Resistance for Supply Path: 0.4 Ω Typical
Wide V
CC
Operating Range: 1.65 V to 4.3 V
Low Pow er Consumption: 1 μA Maximum
- 15 μA Maximum I
CCT
Over Expanded Voltage
Range (V
IN
=1.8 V, V
CC
=4.3 V)
Wide -3 db Bandwidth: > 160 MHz
Packaged in:
- Pb-free 16-Lead MLP & 16-Lead UMLP
3 kV ESD Rating, >12 kV Pow er/GND ESD Rating
Applications
Cell phone, PDA, Digital Camera, and Notebook
LCD Monitor, TV, and Set-Top Box
Description
The FSA2567 is a bi-directional, low -pow er, dual double-
pole, double-throw (4PDT) analog switch targeted at dual
SIM card multiplexing. It is optimized for switching the
WLAN-SIM data and control signals and dedicates one
channel as a supply-source switch.
The FSA2567 is compatible w ith the requirements of SIM
cards and features a low on capacitance (C
ON
) of 10 pF
to ensure high-speed data transfer. The V
SIM
sw itch path
has a low R
ON
characteristic to ensure minimal voltage
drop in the dual SIM card supply paths.
The FSA2567 contains special circuitry that minimizes
current consumption w hen the control voltage applied to
the SEL pin is lower than the supply voltage (V
CC
). This
feature is especially valuable in ultra-portable applications,
such as cell phones; allow ing direct interface with the
general-purpose I/Os of the baseband processor. Other
applications include sw itching and connector sharing in
portable cell phones, PDAs, digital cameras, printers, and
notebook computers.
Ordering Information
Part Number Top Mark
Operating
Temperature
Range
Package
FSA2567MPX FSA2567 -40 to +85°C
16-Lead, Molded Leadless Package (MLP) Quad, JEDEC MO-
220, 3 mm Square
FSA2567UMX GX
16-Lead, Quad, Ultrathin Molded Leadless Package (UMLP),
1.8 x 2.6 mm
Downloaded from Arrow.com.Downloaded from Arrow.com.
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