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INA226AIDGST
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INA226
SBOS547A JUNE 2011REVISED AUGUST 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
V
VS
Supply voltage 6 V
Differential (V
IN+
V
IN-
)
(2)
–40 40
Analog Inputs,
V
IN+, IN–
Common-Mode (V
IN+
+ V
IN-
) / 2 –0.3 40
V
VBUS
–0.3 40 V
V
SDA
GND 0.3 6 V
V
SCL
GND 0.3 V
VS
+ 0.3 V
I
IN
Input current into any pin 5 mA
I
OUT
Open-drain digital output current 10 mA
T
J
Junction temperature 150 °C
T
stg
Storage temperature range –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) IN+ and IN– may have a differential voltage between –40 V and 40 V. However, the voltage at these pins must not exceed the range
–0.3 V to 40 V.
6.2 ESD Ratings
VALUE UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins
(1)
±2500
Electrostatic Charged device model (CDM), per JEDEC specification JESD22-C101, all
V
(ESD)
±1000 V
discharge pins
(2)
Machine model (MM) ±150
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
V
CM
Common-mode input voltage 12 V
V
VS
Operating supply voltage 3.3 V
T
A
Operating free-air temperature –40 125 °C
6.4 Thermal Information
INA226
THERMAL METRIC
(1)
DGS (VSSOP) UNIT
10 PINS
R
θJA
Junction-to-ambient thermal resistance 171.4 °C/W
R
θJC(top)
Junction-to-case (top) thermal resistance 42.9 °C/W
R
θJB
Junction-to-board thermal resistance 91.8 °C/W
ψ
JT
Junction-to-top characterization parameter 1.5 °C/W
ψ
JB
Junction-to-board characterization parameter 90.2 °C/W
R
θJC(bot)
Junction-to-case (bottom) thermal resistance n/a °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated
Product Folder Links: INA226

INA226AIDGST 数据手册

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