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LM2940CT-12.0 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
封装:
TO-220-3
描述:
LDO)/LM2940CT-12.0 管装
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
典型应用电路图在P1
原理图在P13
封装尺寸在P19P20P21P22P24P25P26P27
标记信息在P19P20P21P22P23
封装信息在P19P20P21P22P23P24P25P26P27
技术参数、封装参数在P3P14
应用领域在P34
电气规格在P3P4P5P6P7P8P9P10P11P12
导航目录
LM2940CT-12.0数据手册
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LM2940-N, LM2940C
www.ti.com
SNVS769I –MARCH 2000–REVISED APRIL 2013
Absolute Maximum Ratings
(1)(2)
LM2940-N KTT, NFE, NAC, NDE, DCY ≤ 100 ms 60V
LM2940C KTT, NDE ≤ 1 ms 45V
Internal Power Dissipation
(3)
Internally Limited
Maximum Junction Temperature 150°C
Storage Temperature Range −65°C ≤ T
J
≤ +150°C
TO-220 (NDE), Wave 260°C, 10s
DDPAK/ TO-263 (KTT) 235°C, 30s
Soldering Temperature
(4)
SOT-223 (DCY) 260°C, 30s
WSON-8 (NGN) 235°C, 30s
ESD Susceptibility
(5)
2 kV
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which
the device functions but the specifications might not be ensured. For ensured specifications and test conditions see the Electrical
Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) The maximum allowable power dissipation is a function of the maximum junction temperature, T
J
, the junction-to-ambient thermal
resistance, θ
JA
, and the ambient temperature, T
A
. Exceeding the maximum allowable power dissipation will cause excessive die
temperature, and the regulator will go into thermal shutdown. The value of θ
JA
(for devices in still air with no heatsink) is 60°C/W for the
TO-220 package, 80°C/W for the DDPAK/TO-263 package, and 174°C/W for the SOT-223 package. The effective value of θ
JA
can be
reduced by using a heatsink (see Application Hints for specific information on heatsinking). The value of θ
JA
for the WSON package is
specifically dependent on PCB trace area, trace material, and the number of layers and thermal vias. For improved thermal resistance
and power dissipation for the WSON package, refer to Application Note AN-1187 (SNOA401). It is recommended that 6 vias be placed
under the center pad to improve thermal performance.
(4) Refer to JEDEC J-STD-020C for surface mount device (SMD) package reflow profiles and conditions. Unless otherwise stated, the
temperature and time are for Sn-Pb (STD) only.
(5) ESD rating is based on the human body model, 100 pF discharged through 1.5 kΩ.
Operating Conditions
(1)
Input Voltage 26V
LM2940-N NDE, LM2940-N KTT −40°C ≤ T
J
≤ 125°C
LM2940C NDE, LM2940C KTT 0°C ≤ T
J
≤ 125°C
Temperature Range LM2940-N DCY −40°C ≤ T
A
≤ 85°C
LM2940-N NFE, LM2940-N NAC −55°C ≤ T
J
≤ 125°C
LM2940-N NGN −40°C ≤ T
J
≤ 125°C
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which
the device functions but the specifications might not be ensured. For ensured specifications and test conditions see the Electrical
Characteristics.
Copyright © 2000–2013, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: LM2940-N LM2940C
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