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LM317EMP 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
稳压芯片
封装:
TO-261-4
描述:
LM117 / LM317A / LM317 -N三端可调稳压器 LM117/LM317A/LM317-N 3-Terminal Adjustable Regulator
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P3P4Hot
典型应用电路图在P1P15P16P17P18P19P20P21P22P23P24P25
原理图在P12
封装尺寸在P36P38P39
标记信息在P36P37
封装信息在P35P36P37P38P39
技术参数、封装参数在P5P6P35
应用领域在P1P15P16P17P18P19P20P21P22P23P24P25
电气规格在P6P7
导航目录
LM317EMP数据手册
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LM117
,
LM317-N
www.ti.com
SNVS774P –MAY 2004–REVISED OCTOBER 2015
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)(2)
MIN MAX UNIT
Power dissipation Internally Limited
Input-output voltage differential −0.3 40 V
Metal package (soldering, 10 seconds) 300 °C
Lead temperature
Plastic package (soldering, 4 seconds) 260 °C
Storage temperature, T
stg
−65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
7.2 ESD Ratings
VALUE UNIT
Electrostatic
V
(ESD)
Human-body model (HBM)
(1)
±3000 V
discharge
(1) Manufacturing with less than 500-V HBM is possible with the necessary precautions. Pins listed as ±3000 V may actually have higher
performance.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Operating temperature (LM117) −55 150 °C
Operating temperature (LM317-N) 0 125 °C
7.4 Thermal Information, LM117
LM117
NDS NDT
THERMAL METRIC
(1)
UNIT
(TO-3) (TO)
2 PINS 3 PINS
R
θJA
Junction-to-ambient thermal resistance
(2)
39 186 °C/W
R
θJC(top)
Junction-to-case (top) thermal resistance 2 21 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
(2) No heatsink.
Copyright © 2004–2015, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links: LM117 LM317-N
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