Datasheet 搜索 > 稳压芯片 > Linear Technology（凌力尔特） > LT3021ES8-1.2#TRPBF 数据手册 > LT3021ES8-1.2#TRPBF 数据手册 14/16 页
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LT3021ES8-1.2#TRPBF 数据手册 - Linear Technology（凌力尔特）
制造商:
Linear Technology（凌力尔特）
分类:
稳压芯片
封装:
SOIC-8
Pictures:
3D模型
符号图
焊盘图
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引脚图在P9Hot
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原理图在P9
封装尺寸在P14P15
焊盘布局在P15
标记信息在P3
封装信息在P3
技术参数、封装参数在P5
应用领域在P1P9P10P11P12P13P14
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LT3021ES8-1.2#TRPBF数据手册
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of 16 Go
若手册格式错乱，请下载阅览PDF原文件
LT3021/LT3021-1.2/
LT3021-1.5/LT3021-1.8
14
3021fc
APPLICATIONS INFORMATION
If the LT3021 is powered by a battery mounted in close
proximity on the same circuit board, a 3.3μF input capacitor
is suffi cient for stability. However, if the LT3021 is powered
by a distant supply, use a larger value input capacitor fol-
lowing the guideline of roughly 1μF (in addition to the 3.3μF
minimum) per 8 inches of wire length. As power supply
output impedance may vary, the minimum input capaci-
tance needed to stabilize the application may also vary.
Extra capacitance may also be placed directly on the output
of the power supply; however, this will require an order of
magnitude more capacitance as opposed to placing extra
capacitance in close proximity to the LT3021. Furthermore,
series resistance may be placed between the supply and
the input of the LT3021 to stabilize the application; as little
as 0.1Ω to 0.5Ω will suffi ce.
PACKAGE DESCRIPTION
DH Package
16-Lead Plastic DFN (5mm × 5mm)
(Reference LTC DWG # 05-08-1709)
5.00 ±0.10
5.00 ±0.10
NOTE:
1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WJJD-1) IN JEDEC
PACKAGE OUTLINE MO-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
0.40 ± 0.05
BOTTOM VIEW—EXPOSED PAD
3.45 ± 0.10
(2 SIDES)
0.75 ±0.05
R = 0.115
TYP
R = 0.20
TYP
4.10 ±0.10
(2 SIDES)
18
169
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DH16) DFN 0204
0.25 ± 0.05
PIN 1
NOTCH
0.50 BSC
4.10 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
3.45 ±0.05
(2 SIDES)
4.10 ±0.05
0.50 BSC
0.70 ±0.05
5.50 ±0.05
PACKAGE
OUTLINE
0.25 ± 0.05
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