Datasheet 搜索 > 稳压芯片 > Linear Technology（凌力尔特） > LT3021ES8-1.2#TRPBF 数据手册 > LT3021ES8-1.2#TRPBF 数据手册 15/16 页
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LT3021ES8-1.2#TRPBF 数据手册 - Linear Technology（凌力尔特）
制造商:
Linear Technology（凌力尔特）
分类:
稳压芯片
封装:
SOIC-8
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P9Hot
典型应用电路图在P1
原理图在P9
封装尺寸在P14P15
焊盘布局在P15
标记信息在P3
封装信息在P3
技术参数、封装参数在P5
应用领域在P1P9P10P11P12P13P14
电气规格在P4P5P6P7P8P9P10P11
导航目录
LT3021ES8-1.2#TRPBF数据手册
Page:
of 16 Go
若手册格式错乱，请下载阅览PDF原文件
LT3021/LT3021-1.2/
LT3021-1.5/LT3021-1.8
15
3021fc
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
S8 Package
8-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610)
.016 – .050
(0.406 – 1.270)
.010 – .020
(0.254 – 0.508)
×
45
°
0
°
– 8
°
TYP
.008 – .010
(0.203 – 0.254)
SO8 0303
.053 – .069
(1.346 – 1.752)
.014 – .019
(0.355 – 0.483)
TYP
.004 – .010
(0.101 – 0.254)
.050
(1.270)
BSC
1
2
3
4
.150 – .157
(3.810 – 3.988)
NOTE 3
8
7
6
5
.189 – .197
(4.801 – 5.004)
NOTE 3
.228 – .244
(5.791 – 6.197)
.245
MIN
.160
±.005
RECOMMENDED SOLDER PAD LAYOUT
.045 ±.005
.050 BSC
.030 ±.005
TYP
INCHES
(MILLIMETERS)
NOTE:
1. DIMENSIONS IN
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
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