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MAX14803CCM+CP3 数据手册 - Maxim Integrated（美信）
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Maxim Integrated（美信）
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MAX14803CCM+CP3数据手册
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MAX14802/MAX14803/MAX14803A
Low-Charge Injection, 16-Channel,
High-Voltage Analog Switches
2
Maxim Integrated
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(V
DD
= +2.7V to +5.5V, V
PP
= +40V to V
NN
+ 250V, V
NN
= -40V to -160V, T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values
are at T
A
= +25°C.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial
.
(All voltages referenced to GND.)
V
DD
Logic-Supply Voltage .......................................-0.3V to +7V
V
PP
- V
NN
Supply Voltage
(MAX14802CCM+, MAX14803CCM+)..............................260V
(MAX14802ECM+, MAX14803AEWZ+) ............................230V
V
PP
Positive-Supply Voltage.................................-0.3V to +220V
V
NN
Negative-Supply Voltage ...............................-0.3V to -220V
Logic Inputs (LE, CLR, CLK, DIN, DOUT)................-0.3V to +7V
COM_, NO_...............................(-0.3V + V
NN
) to the minimum of
[(V
NN
+ 220V) or (V
PP
+ 0.3V)]
Peak Analog Signal Current Per Channel ................................3A
Continuous Power Dissipation (T
A
= +70°C)
48-Pin TQFP (derate 22.7mW/°C above +70°C).........1818mW
110-Bump WLP (derate 37mW°C above +70°C)........2960mW
Operating Temperature Range (Commercial)........0°C to +70°C
Operating Temperature Range (Extended).........-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature..................................................... +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TQFP
Junction-to-Ambient Thermal Reistance (
θ
JA
)..............44°C/W
Junction-to-Case Thermal Resistance (
θ
JC
).................10°C/W
WLP
Junction-to-Ambient Thermal Reistance (
θ
JA
)..............27°C/W
Junction-to-Case Thermal Resistance (
θ
JC
)...................1°C/W
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
POWER SUPPLIES
V
DD
Supply Voltage V
DD
+2.7 +5.5 V
MAX14802ECM+, MAX14803AEWZ+ +40 +100
V
NN
+
200
V
PP
Supply Voltage V
PP
MAX14802CCM+, MAX14803CCM+ +40 +100
V
NN
+
250
V
V
NN
Supply Voltage V
NN
-160 -100 0 V
V
DD
Supply Quiescent
Current
I
DDQ
5μA
V
DD
Supply Dynamic
Current
I
DD
V
DD
= +5V, V
LE
= +5V, f
CLK
= 5MHz 0.5 mA
V
PP
Supply Quiescent
Current
I
PPQ
All switches remain on or off, I
COM_
= 5mA 0 10 μA
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