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器件3D模型￥ 15.521
MAX14850AEE+T 数据手册 - Maxim Integrated（美信）
制造商:
Maxim Integrated（美信）
分类:
接口隔离器
封装:
SSOP-16
描述:
数字隔离器 Six Channel 600vrms Digital Isolator
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MAX14850AEE+T数据手册
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MAX14850
Six-Channel Digital Isolator
2Maxim Integrated
V
CCA
to GNDA ........................................................-0.3V to +6V
V
CCB
to GNDB ........................................................-0.3V to +6V
OUTA1, OUTA2 to GNDA ..................... -0.3V to (V
CCA
+ 0.3V)
OUTB1, OUTB2 to GNDB ..................... -0.3V to (V
CCB
+ 0.3V)
INB1, INB2, I/OA1, I/OA2 to GNDA ........................-0.3V to +6V
INA1, INA2, I/OB1, I/OB2 to GNDB ........................-0.3V to +6V
Short-Circuit Duration (OUTA_ to GNDA or
V
CCA
, OUTB_ to GNDB or V
CCB
) .........................Continuous
Continuous Current (I/OA_, I/OB_) Pin ............................ Q50mA
Continuous Power Dissipation (T
A
= +70NC)
SOIC (derate 13.3mW/NC above +70NC) ..............1067mW
QSOP (derate 9.6mW/NC above +70NC)..............771.5mW
Operating Temperature Range ........................ -40NC to +125NC
Junction Temperature .....................................................+150NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
Absolute Maximum Ratings
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
SOIC
Junction-to-Ambient Thermal Resistance (B
JA
) ..........75NC/W
Junction-to-Case Thermal Resistance (B
JC
) ...............24NC/W
QSOP
Junction-to-Ambient Thermal Resistance (B
JA
) .....103.7NC/W
Junction-to-Case Thermal Resistance (B
JC
) ...............37NC/W
Package Thermal Characteristics
(Note 1)
Electrical Characteristics
(V
CCA
- V
GNDA
= 3.0V to 5.5V, V
CCB
- V
GNDB
= 3.0V to 5.5V, T
A
= -40°C to +125°C, unless otherwise noted. Typical values are at
V
CCA
- V
GNDA
= 3.3V, V
CCB
- V
GNDB
= 3.3V, and T
A
= +25°C.) (Note 2)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNIT
DC CHARACTERISTICS
Supply Voltage
V
CCA
Relative to GNDA 3.0 5.5
V
V
CCB
Relative to GNDB 3.0 5.5
Supply Current
I
CCA
,
I
CCB
Unidirectional inputs
at DC or 2Mbps;
bidirectional inputs at DC
or switching at 2Mbps,
no load
V
CCA
= +5V,
V
CCB
= +5V
7.2 11
mA
V
CCA
= +3.3V,
V
CCB
= +3.3V
6.2 9.5
All inputs switching at
max data rate. No load.
(Note 3)
V
CCA
= +5V,
V
CCB
=
+5V
T
A
=
+25°C
15 22
T
A
=
+125°C
17 24
V
CCA
=
+3.3V,
V
CCB
=
+3.3V
T
A
=
+25°C
10 16
T
A
=
+125°C
11 18
Undervoltage-Lockout
Threshold
V
UVLO
V
CCA
- V
GNDA
, V
CCB
- V
GNDB
(Note 4) 2 V
Undervoltage-Lockout
Hysteresis
V
UVLOHYS
V
CCA
- V
GNDA
, V
CCB
- V
GNDB
(Note 4) 0.1 V
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