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MC14049UBDR2 数据手册 - ON Semiconductor（安森美）
制造商:
ON Semiconductor（安森美）
分类:
逻辑芯片
封装:
SOIC-16
描述:
六角缓冲器 Hex Buffers
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
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封装尺寸在P5P6P7
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型号编码规则在P1P3P7
标记信息在P1P7
封装信息在P3
技术参数、封装参数在P1P3
应用领域在P1P3
电气规格在P2
型号编号列表在P1
导航目录
MC14049UBDR2数据手册
Page:
of 7 Go
若手册格式错乱，请下载阅览PDF原文件
MC14049UB
http://onsemi.com
7
PACKAGE DIMENSIONS
SOEIAJ−16
F SUFFIX
CASE 966
ISSUE A
H
E
A
1
DIM MIN MAX MIN MAX
INCHES
--- 2.05 --- 0.081
MILLIMETERS
0.05 0.20 0.002 0.008
0.35 0.50 0.014 0.020
0.10 0.20 0.007 0.011
9.90 10.50 0.390 0.413
5.10 5.45 0.201 0.215
1.27 BSC 0.050 BSC
7.40 8.20 0.291 0.323
0.50 0.85 0.020 0.033
1.10 1.50 0.043 0.059
0
0.70 0.90 0.028 0.035
--- 0.78 --- 0.031
A
1
H
E
Q
1
L
E
_
10
_
0
_
10
_
L
E
Q
1
_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
M
L
DETAIL P
VIEW P
c
A
b
e
M
0.13 (0.005)
0.10 (0.004)
1
16 9
8
D
Z
E
A
b
c
D
E
e
L
M
Z
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