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MC9S08SH4CTJ 数据手册 - Freescale（飞思卡尔）
制造商:
Freescale（飞思卡尔）
分类:
微控制器
封装:
TSSOP-20
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P29P30P31P32P33P34P35P36P69P81P192P245Hot
典型应用电路图在P28
原理图在P26P82P84P120P121P122P130P131P132P156P157P158
封装尺寸在P1P326
型号编码规则在P325P326
封装信息在P325
功能描述在P125P142P157P163P179P197P204P211P221P222P223P240
技术参数、封装参数在P295P296P307
应用领域在P217
电气规格在P79P295P296P297P298P299P300P301P302P303P304P305
导航目录
MC9S08SH4CTJ数据手册
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Freescale Semiconductor
Addendum
Document Number: QFN_Addendum
Rev. 0, 07/2014
© Freescale Semiconductor, Inc., 2014. All rights reserved.
This addendum provides the changes to the 98A case outline numbers for products covered in this book.
Case outlines were changed because of the migration from gold wire to copper wire in some packages. See
the table below for the old (gold wire) package versus the new (copper wire) package.
To view the new drawing, go to Freescale.com and search on the new 98A package number for your
device.
For more information about QFN package use, see EB806: Electrical Connection Recommendations for
the Exposed Pad on QFN and DFN Packages.
Addendum for New QFN
Package Migration
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