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器件3D模型￥ 0.361
MCP6S26-I/SL 数据手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
放大器、缓冲器
封装:
SOIC-14
描述:
MICROCHIP MCP6S26-I/SL 可编程/可变增益放大器, 6 放大器, 1个放大器, 12 MHz, -40 °C, 125 °C, 2.5V 至 5.5V
Pictures:
3D模型
符号图
焊盘图
引脚图
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页面导航:
引脚图在P15Hot
典型应用电路图在P1P26
原理图在P1P16
标记信息在P28P29P30
封装信息在P28P31P32P33P34P35P36P37P38P39
技术参数、封装参数在P3P4P5P22
应用领域在P1P17P25P26
电气规格在P3P4P5P22P25
导航目录
MCP6S26-I/SL数据手册
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若手册格式错乱，请下载阅览PDF原文件
2003-2012 Microchip Technology Inc. DS21117B-page 5
MCP6S21/2/6/8
TEMPERATURE CHARACTERISTICS
FIGURE 1-1: Channel Select Timing
Diagram.
FIGURE 1-2: PGA Shutdown timing
diagram (must enter correct commands before
CS
goes high).
FIGURE 1-3: Gain Select Timing
Diagram.
FIGURE 1-4: POR power-up and power-
down timing diagram.
Electrical Specifications: Unless otherwise indicated, V
DD
= +2.5V to +5.5V, V
SS
= GND.
Parameters Sym Min Typ Max Units Conditions
Temperature Ranges
Specified Temperature Range T
A
-40 — +85 °C
Operating Temperature Range T
A
-40 — +125 °C (Note 1)
Storage Temperature Range T
A
-65 — +150 °C
Thermal Package Resistances
Thermal Resistance, 8L-PDIP
JA
—85—°C/W
Thermal Resistance, 8L-SOIC
JA
—163—°C/W
Thermal Resistance, 8L-MSOP
JA
—206—°C/W
Thermal Resistance, 14L-PDIP
JA
—70—°C/W
Thermal Resistance, 14L-SOIC
JA
—120—°C/W
Thermal Resistance, 14L-TSSOP
JA
—100—°C/W
Thermal Resistance, 16L-PDIP
JA
—70—°C/W
Thermal Resistance, 16L-SOIC
JA
—90—°C/W
Note 1: The MCP6S21/2/6/8 family of PGAs operates over this extended temperature range, but with reduced
performance. Operation in this range must not cause T
J
to exceed the Maximum Junction Temperature
(150°C).
CS
V
OUT
t
CH
0.6V
0.3V
CS
t
OFF
V
OUT
t
ON
Hi-Z Hi-Z
I
SS
500 nA (typ)
1.0 mA (typ)
0.3V
CS
V
OUT
t
G
1.5V
0.3V
V
DD
t
RPD
V
OUT
t
RPU
Hi-Z Hi-Z
V
POR
- 0.1V V
POR
- 0.1V
V
POR
+ 0.1V
0.3V
I
SS
500 nA (typ)
1.0 mA (typ)
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