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MMBFJ177
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MMBFJ177数据手册
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© Semiconductor Components Industries, LLC, 2015
January, 2015 − Rev. 7
1 Publication Order Number:
MMBFJ177LT1/D
MMBFJ177LT1G,
SMMBFJ177LT1G
JFET Chopper
P−Channel − Depletion
Features
S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS
Rating Symbol Value Unit
Drain−Gate Voltage V
DG
−25 Vdc
Gate−Source Voltage V
GS
25 Vdc
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Total Device Dissipation FR−5 Board
(Note 1)
T
A
= 25°C
Derate above 25°C
P
D
225
1.8
mW
mW/°C
Thermal Resistance,
Junction−to−Ambient
R
q
JA
556 °C/W
Junction and Storage Temperature T
J
, T
stg
55 to +150 °C
1. FR−5 = 1.0 0.75 0.062 in.
www.onsemi.com
MARKING DIAGRAM
SOT−23 (TO−236AB)
CASE 318−08
STYLE 10
2 SOURCE
3
GATE
1 DRAIN
1
2
3
Device Package Shipping
ORDERING INFORMATION
MMBFJ177LT1G SOT−23
(Pb−Free)
3000 / Tape &
Reel
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
s
Brochure, BRD8011/D.
1
6Y MG
G
6Y = Specific Device Code
M = Date Code*
G = Pb−Free Package
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
(Note: Microdot may be in either location)
SMMBFJ177LT1G SOT−23
(Pb−Free)
3000 / Tape &
Reel

MMBFJ177 数据手册

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