MMBT2907 数据手册 - Fairchild（飞兆/仙童）

Date Created : 2007/11/30

Date Issued On : 2007/12/12

PCN# : Q4074815

FORECAST CHANGE NOTIFICATION

This is to inform you that a design and/or process change will be made to the following

product(s). This notification is for your information and concurrence. This is a preliminary

notification. A Final PCN will be issued when qualification is complete and data is available.

If you require data or samples to qualify this change, please contact Fairchild Semiconductor

within 30 days of receipt of this notification.

Name: Ursal, Randy

E-mail: Randy.Ursal@notes.fairchildsemi.com

Phone:

Implementation of change:

Expected 1st Device Shipment Date: 2008/03/30

Earliest Year/Work Week of Changed Product: 0814

Change Type Description: Mold Compound

Description of Change (From): SOT23 and SC70 package assembly at all FSC approved

manufacturing locations (FSCP, CARSEM, HANA, UTL, AUK in Dalian, China, JCET,

FSPM) using non Green mold compound as shown in table 1:

to provide a 'Full Green' (Halogen Free Flame Retardant) package. For additional details on the

corporate wide green initiative please visit our Web site at:

http://www.fairchildsemi.com/company/green/index.html Manufacturing will occur at the same

assembly facilities producing the current non-green products. Package outline drawings of the

affected products remain un-changed. Green products will be fully compliant to all published

data sheet specifications and will be interchangeable with current non-green product. Quality

and reliability will remain at the highest standards already demonstrated with Fairchild's

existing products.

Qual/REL Plan Numbers : Q20070464

Qualification :