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OPA320S 数据手册 - TI（德州仪器）
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OPA320S数据手册
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OPA320, OPA2320
OPA320S, OPA2320S
www.ti.com
SBOS513E –AUGUST 2010–REVISED JUNE 2013
THERMAL INFORMATION: OPA320, OPA320S
OPA320 OPA320S
THERMAL METRIC
(1)
DBV (SOT23) DBV (SOT23) UNITS
5 PINS 6 PINS
θ
JA
Junction-to-ambient thermal resistance 219.3 177.5
θ
JC(top)
Junction-to-case(top) thermal resistance 107.5 108.9
θ
JB
Junction-to-board thermal resistance 57.5 27.4
°C/W
ψ
JT
Junction-to-top characterization parameter 7.4 13.3
ψ
JB
Junction-to-board characterization parameter 56.9 26.9
θ
JC(bottom)
Junction-to-case(bottom) thermal resistance N/A N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
THERMAL INFORMATION: OPA2320, OPA2320S
OPA2320 OPA2320S
THERMAL METRIC
(1)
D (SO) DGK (MSOP) DRG (DFN) DGS (MSOP) UNITS
8 PINS 8 PINS 8 PINS 10 PINS
θ
JA
Junction-to-ambient thermal resistance 122.6 174.8 50.6 171.5
θ
JC(top)
Junction-to-case(top) thermal resistance 67.1 43.9 54.9 43.0
θ
JB
Junction-to-board thermal resistance 64.0 95.0 25.2 91.4
°C/W
ψ
JT
Junction-to-top characterization parameter 13.2 2.0 0.6 1.9
ψ
JB
Junction-to-board characterization parameter 63.4 93.5 25.3 89.9
θ
JC(bottom)
Junction-to-case(bottom) thermal resistance N/A N/A 5.7 N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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