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器件3D模型￥ 34.818
PIC18F4685-E/ML 数据手册 - Microchip（微芯）
制造商:
Microchip（微芯）
分类:
微控制器
封装:
QFN-44
描述:
PIC18 系列 3328 B RAM 96 kB 闪存 8位 微控制器 - QFN-44
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P4P5P167P169P176Hot
典型应用电路图在P193
原理图在P10P12P13P27P43P146P150P154P160P162P168P169
封装尺寸在P459
标记信息在P457P458
封装信息在P457P459P460P461P462P463
技术参数、封装参数在P432P433P434P436P437P438
应用领域在P180P272
电气规格在P107P260P261P265P266
导航目录
PIC18F4685-E/ML数据手册
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若手册格式错乱，请下载阅览PDF原文件
PIC18F2682/2685/4682/4685
DS39761B-page 4 Preliminary © 2007 Microchip Technology Inc.
Table of Contents
1.0 Device Overview .......................................................................................................................................................................... 7
2.0 Oscillator Configurations ............................................................................................................................................................ 23
3.0 Power-Managed Modes ............................................................................................................................................................. 33
4.0 Reset .......................................................................................................................................................................................... 41
5.0 Memory Organization ................................................................................................................................................................. 61
6.0 Flash Program Memory.............................................................................................................................................................. 95
7.0 Data EEPROM Memory ........................................................................................................................................................... 105
8.0 8 x 8 Hardware Multiplier.......................................................................................................................................................... 111
9.0 Interrupts .................................................................................................................................................................................. 113
10.0 I/O Ports ................................................................................................................................................................................... 129
11.0 Timer0 Module ......................................................................................................................................................................... 147
12.0 Timer1 Module ......................................................................................................................................................................... 151
13.0 Timer2 Module ......................................................................................................................................................................... 157
14.0 Timer3 Module ......................................................................................................................................................................... 159
15.0 Capture/Compare/PWM (CCP1) Modules ............................................................................................................................... 163
16.0 Enhanced Capture/Compare/PWM (ECCP1) Module.............................................................................................................. 173
17.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 187
18.0 Enhanced Universal Synchronous Receiver Transmitter (EUSART) ....................................................................................... 227
19.0 10-Bit Analog-to-Digital Converter (A/D) Module ..................................................................................................................... 247
20.0 Comparator Module.................................................................................................................................................................. 257
21.0 Comparator Voltage Reference Module................................................................................................................................... 263
22.0 High/Low-Voltage Detect (HLVD)............................................................................................................................................. 267
23.0 ECAN™ Technology ................................................................................................................................................................ 273
24.0 Special Features of the CPU.................................................................................................................................................... 343
25.0 Instruction Set Summary .......................................................................................................................................................... 363
26.0 Development Support............................................................................................................................................................... 413
27.0 Electrical Characteristics .......................................................................................................................................................... 417
28.0 DC and AC Characteristics Graphs and Tables....................................................................................................................... 453
29.0 Packaging Information.............................................................................................................................................................. 455
Appendix A: Revision History............................................................................................................................................................. 463
Appendix B: Device Differences......................................................................................................................................................... 463
Appendix C: Conversion Considerations ........................................................................................................................................... 464
Appendix D: Migration From Baseline to Enhanced Devices............................................................................................................. 464
Appendix E: Migration from Mid-Range to Enhanced Devices .......................................................................................................... 465
Appendix F: Migration from High-End to Enhanced Devices ............................................................................................................. 465
Index .................................................................................................................................................................................................. 467
The Microchip Web Site ..................................................................................................................................................................... 479
Customer Change Notification Service .............................................................................................................................................. 479
Customer Support .............................................................................................................................................................................. 479
Reader Response .............................................................................................................................................................................. 480
PIC18F2682/2685/4682/4685 Product Identification System ............................................................................................................ 481
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