器件3D模型

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R5F52105BDFN#V0 数据手册 - Renesas Electronics（瑞萨电子）

制造商:

Renesas Electronics（瑞萨电子）

分类:

微控制器

封装:

LQFP

描述:

RX210 微控制器RX210 低功率微控制器具有宽工作范围并且可以在高达 50 MHz 78 DMIPS 时执行计算。使用 RX210 的应用包括数码相机、洗衣机、功率计、智能手机、医疗保健设备和冰箱。工作范围：1.62 V 至 5.3 V 事件链接控制器 (ELC) 多功能引脚控制器 (MPC) 三相电动机控制计时器 (MTU2) 12 位模/数转换器 4 种功耗模式： -睡眠模式 -所有模块时钟停止模式 -软件待机模式 -深度软件待机模式 ### RX 系列微控制器，Renesas ElectronicsRX 系列 32 位闪存微控制器持续发展，用于工业、消费品和办公自动化应用。

Pictures:

3D模型

符号图

焊盘图

引脚图

产品图

页面导航:

引脚图在P13P14P15P16P17P18P19P20P21P22P23P24Hot

原理图在P12

封装尺寸在P17P153P154P155P156P157P158P159P160P161

功能描述在P2P3P4P5

技术参数、封装参数在P2P3P4P5P64

电气规格在P64P65P66P67P68P69P70P71P72P73P74P75

导航目录

引脚图在P13 P14 P15 P16 P17 P18 P19 P20 P21 P22 P23 P24
原理图在P12
封装尺寸在P17 P153 P154 P155 P156 P157 P158 P159 P160 P161
功能描述在P2 P3 P4 P5
技术参数、封装参数在P2 P3 P4 P5 P64
电气规格在P64 P65 P66 P67 P68 P69 P70 P71 P72 P73 P74 P75

R5F52105BDFN#V0数据手册

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Datasheet

R01DS0041EJ0120 Rev.1.20 Page 1 of 162

Nov 28, 2012

RX210 Group

Renesas MCUs

Features

■ 32-bit RX CPU core

 Max. operating frequency: 50 MHz

Capable of 78 DMIPS in operation at 50 MHz

 Accumulator handles 64-bit results (for a single

instruction) from 32- × 32-bit operations

 Multiplication and division unit handles 32- × 32-bit

operations (multiplication instructions take one CPU

clock cycle)

 Fast interrupt

 CISC Harvard architecture with 5-stage pipeline

 Variable-length instructions, ultra-compact code

 On-chip debugging circuit

■ Low power design and architecture

 Operation from a single 1.62-V to 5.5-V supply

 1.62-V operation available (at up to 20 MHz)

 Deep software standby mode with RTC remaining usable

 Four low power modes

■ On-chip flash memory for code, no wait states

 50-MHz operation, 20-ns read cycle

 No wait states for reading at full CPU speed

 64-K to 512-Kbyte capacities

 User code programmable via the SCI

 Programmable at 1.62 V

 For instructions and operands

■ On-chip data flash memory

 8 Kbytes

(Number of times of reprogramming: 100,000)

 Erasing and programming impose no load on the CPU.

■ On-chip SRAM, no wait states

 12-K to 64-Kbyte size capacities

■ DMA

 DMAC: Incorporates four channels

 DTC: Four transfer modes

■ ELC

 Module operation can be initiated by event signals

without going through interrupts.

 Modules can operate while the CPU is sleeping.

■ Reset and supply management

 Nine types of reset, including the power-on reset (POR)

 Low voltage detection (LVD) with voltage settings

■ Clock functions

 Frequency of external clock: Up to 20 MHz

 Frequency of the oscillator for sub-clock generation:

32.768 kHz

 PLL circuit input: 4 MHz to 12.5 MHz

 On-chip low- and high-speed oscillators, dedicated on-

chip low-speed oscillator for the IWDT

 Generation of a dedicated 32.768-kHz clock for the RTC

 Clock frequency accuracy measurement circuit (CAC)

■

Real-time clock

 Adjustment fu

nctions (30 seconds, leap year, and error)

 Time capture functio

 Time capture on event-signal input through external pins

 RTC capable of initiating return from deep software

standby mode

■ Independent watchdog timer

 125-kHz on-chip oscillator produces a dedicated clock

signal to drive IWDT operation.

■ Useful functions for IEC60730 compliance

 Self-diagnostic and disconnection-detection assistance

functions for the A/D converter, clock frequency

accuracy measurement circuit, independent watchdog

timer, functions to assist in RAM testing, etc.

■ Up to nine communications channels

 SCI with many useful functions (up to seven channels)

Asynchronous mode, clock synchronous mode, smart

card interface

 I

C bus interface: Transfer at up to 400 kbps, capable of

SMBus operation (one channel)

 RSPI (one channel)

■ External address space

 Four CS areas (4 × 16 Mbytes)

 8- or 16-bit bus space is selectable per area

■ Up to 14 extended-function timers

 16-bit MTU: input capture, output compare,

complementary PWM output, phase counting mode

(six channels)

 8-bit TMR (four channels)

 16-bit compare-match timers (four channels)

■ 12-bit A/D converter

 Capable of conversion within 1 μs

 Sample-and-hold circuits (for three channels)

 Three-channel synchronized sampling available

 Self-diagnostic function and analog input disconnection

detection assistance function

■ 10-bit D/A converter

■ Analog comparator

■ General I/O ports

 5-V tolerant, open drain, input pull-up, switching of

driving ability

■ MPC

 Multiple locations are selectable for I/O pins of

peripheral functions

■ Temperature sensor

■ Operating temp. range

40C to +85C

40C to +105C

PLQP0100KB-A 14 × 14 mm, 0.5-mm pitch

PLQP0080KB-A 12 × 12 mm, 0.5-mm pitch

PLQP0064KB-A 10 × 10 mm, 0.5-mm pitch

PLQP0048KB-A 7 × 7 mm, 0.5-mm pitch

PLQP0080JA-A 14 × 14 mm, 0.65-mm pitch

PLQP0064GA-A 14 × 14 mm, 0.8-mm pitch

PTLG0100JA-A 7 × 7 mm, 0.65-mm pitch

PTLG0100KA-A 5.5 × 5.5 mm, 0.5-mm pitch

PTLG0064JA-A 6 × 6 mm, 0.65-mm pitch

50-MHz 32-bit RX MCUs, 78 DMIPS, up to 512-KB flash memory,

12-bit A/D, 10-bit D/A, ELC, MPC, RTC, up to 9 comms channels;

incorporating functions for IEC60730 compliance

R01DS0041EJ0120

Rev.1.20

Nov 28, 2012

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