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器件3D模型￥ 65.061
SPC563M64L5COAR 数据手册 - ST Microelectronics（意法半导体）
制造商:
ST Microelectronics（意法半导体）
分类:
32位控制器
封装:
LQFP-144
描述:
芯片
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P7P13Hot
原理图在P39
封装尺寸在P122
型号编码规则在P130P131
封装信息在P79P131
功能描述在P68P69P70P71
技术参数、封装参数在P73P74
应用领域在P79P139
电气规格在P7P73P74P75P76P77P78P79P80P81P82P83
导航目录
SPC563M64L5COAR数据手册
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February 2011 Doc ID 14642 Rev 8 1/139
1
SPC563M64
32-bit Power Architecture
®
based MCU for automotive
powertrain applications
Features
■ Single issue, 32-bit Power Architecture
®
Book
E compliant e200z335 CPU core complex
– Includes variable length encoding (VLE)
enhancements for code size reduction
■ 32-channel direct memory access controller
(DMA)
■ Interrupt controller (INTC) capable of handling
364 selectable-priority interrupt sources: 191
peripheral interrupt sources, 8 software
interrupts and 165 reserved interrupts.
■ Frequency-modulated phase-locked loop
(FMPLL)
■ Calibration external bus interface (EBI)
(a)
■
System integration unit (SIU)
■ Up to 1.5 Mbyte on-chip Flash with Flash
controller
– Fetch Accelerator for single cycle Flash
access @80 MHz
■ Up to 94 Kbyte on-chip static RAM (including
up to 32 Kbyte standby RAM)
■ Boot assist module (BAM)
■ 32-channel second-generation enhanced time
processor unit (eTPU)
– 32 standard eTPU channels
– Architectural enhancements to improve
code efficiency and added flexibility
■ 16-channels enhanced modular input-output
system (eMIOS)
■ Enhanced queued analog-to-digital converter
(eQADC)
■ Decimation filter (part of eQADC)
■ Silicon die temperature sensor
■ 2 deserial serial peripheral interface (DSPI)
modules (compatible with Microsecond Bus)
■ 2 enhanced serial communication interface
(eSCI) modules compatible with LIN
■ 2 controller area network (FlexCAN) modules
that support CAN 2.0B
■ Nexus port controller (NPC) per IEEE-ISTO
5001-2003 standard
■ IEEE 1149.1 (JTAG) support
■ Nexus interface
■ On-chip voltage regulator controller that
provides 1.2 V and 3.3 V internal supplies from
a 5 V external source.
■ Designed for LQFP100, LQFP144, LQFP176
and LBGA208.
a. The external bus interface is only accessible when
using the calibration tool. It is not available on
production packages.
LFBGA208
17 mm x 17 mm
x1.5mm
144 LQFP
20 mm x 20 mm
100 LQFP
14 mm x 14 mm
176 LQFP
24 mm x 24 m
m
Table 1. Device summary
Memory Flash size
Part number
Package: LQFP100 Package: LQFP144 Package: LQFP176 Package: LBGA208
1536 Kbyte — SPC563M64L5 SPC563M64L7 —
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