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STM32F401RBT6 数据手册 - ST Microelectronics(意法半导体)
制造商:
ST Microelectronics(意法半导体)
分类:
微控制器
封装:
LQFP-64
描述:
STMICROELECTRONICS STM32F401RBT6 微控制器, 32位, 动态效率线, ARM 皮质-M4, 84 MHz, 128 KB, 64 KB, 64 引脚, LQFP
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P32P33P34P35P36P37P38P39P40P41P42P43Hot
典型应用电路图在P77P78P108
封装尺寸在P114P115P116P117P118P119P120P121P122P123P124P125
型号编码规则在P130
技术参数、封装参数在P57P87
电气规格在P54P55P56P57P58P59P60P61P62P63P64P65
导航目录
STM32F401RBT6数据手册
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DocID024738 Rev 5 117/134
STM32F401xB STM32F401xC Package information
130
7.2 UFQFPN48 package information
Figure 49. UFQFPN48 - 48-lead, 7 x 7 mm, 0.5 mm pitch, ultra thin fine pitch
quad flat package outline
1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and
solder this back-side pad to PCB ground.
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Table 81. UFQFPN48 - 48-lead, 7 x 7 mm, 0.5 mm pitch, ultra thin fine pitch
quad flat package mechanical data
Symbol
millimeters inches
(1)
Min. Typ. Max. Min. Typ. Max.
A 0.500 0.550 0.600 0.0197 0.0217 0.0236
A1 0.000 0.020 0.050 0.0000 0.0008 0.0020
D 6.900 7.000 7.100 0.2717 0.2756 0.2795
E 6.900 7.000 7.100 0.2717 0.2756 0.2795
D2 5.500 5.600 5.700 0.2165 0.2205 0.2244
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