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STRVS280X02F
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Characteristics STRVSX
6/14 DocID023950 Rev 4
Figure 16. Thermal resistance junction to
ambient versus copper surface of connections -
SMB
Figure 17. Thermal resistance junction to
ambient versus copper surface of connections -
SMC
0
20
40
60
80
100
120
140
160
180
200
012345678910
R
th(j-a)
(°C/W)
Copper surface (cm
2
)
0
20
40
60
80
100
120
140
160
180
200
012345678910
R
th(j-a)
(°C/W)
Copper surface (cm
2
)
Figure 18. Thermal resistance junction to
ambient versus copper surface of connections -
DO-15
Figure 19. Thermal resistance junction to
ambient versus copper surface of connections -
DO-201
0
50
100
150
012345
R
th(j-a)
(°C/W)
Copper surface (cm
2
)
0
50
100
150
012345
R
th(j-a)
(°C/W)
Copper surface (cm
2
)

STRVS280X02F 数据手册

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STRVS280X02 数据手册

ST Microelectronics(意法半导体)
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