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TJA1051T118 数据手册 - NXP（恩智浦）
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TJA1051T118数据手册
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TJA1051 All information provided in this document is subject to legal disclaimers. © NXP N.V. 2016. All rights reserved.
Product data sheet Rev. 8 — 12 July 2016 4 of 24
NXP Semiconductors
TJA1051
High-speed CAN transceiver
6. Pinning information
6.1 Pinning
6.2 Pin description
[1] HVSON8 package die supply ground is connected to both the GND pin and the exposed center pad. The
GND pin must be soldered to board ground. For enhanced thermal and electrical performance, it is
recommended that the exposed center pad also be soldered to board ground.
a. TJA1051T: SO8 b. TJA1051T/E: SO8
c. TJA1051T/3: SO8 d. TJA1051TK/3: HVSON8
Fig 2. Pin configuration diagrams
7;'
6
*1' &$1+
9
&&
&$1/
5;' QF
DDD
7-$7
7;'
6
*1' &$1+
9
&&
&$1/
5;'
(
1
DDD
7-$7(
7;'
6
*1' &$1+
9
&&
&$1/
5;'
9
,
2
DDD
7-$7
5;'
9
&&
*1'
7;'
9
,
2
&$1/
&$1+
6
DDD
7-$7.
WHUPLQDO
LQGH[DUHD
7UDQVSDUHQWWRSYLHZ
Table 3. Pin description
Symbol Pin Description
TXD 1 transmit data input
GND
[1]
2 ground
V
CC
3 supply voltage
RXD 4 receive data output; reads out data from the bus lines
n.c. 5 not connected; in TJA1051T version
EN 5 enable control input; TJA1051T/E only
V
IO
5 supply voltage for I/O level adapter; TJA1051T/3 and TJA1051TK/3 only
CANL 6 LOW-level CAN bus line
CANH 7 HIGH-level CAN bus line
S 8 Silent mode control input
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