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TLE2024AIN 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
放大器、缓冲器
封装:
PDIP-14
描述:
神剑高速低功耗精密运算放大器 EXCALIBUR HIGH-SPEED LOW-POWER PRECISION OPERATIONAL AMPLIFIERS
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P4P5P6Hot
封装尺寸在P56P57P58P59P60P61P62P63P66P67P73
焊盘布局在P74
标记信息在P56P57P58P59P60P61P62P63P64
封装信息在P56P57P58P59P60P61P62P63P64P65P66P67
应用领域在P65P80
导航目录
TLE2024AIN数据手册
Page:
of 80 Go
若手册格式错乱，请下载阅览PDF原文件
TLE202x, TLE202xA, TLE202xB, TLE202xY
EXCALIBUR HIGH-SPEED LOW-POWER PRECISION
OPERATIONAL AMPLIFIERS
SLOS191D − FEBRUARY 1997 − REVISED NOVEMBER 2010
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLE2021 AVAILABLE OPTIONS
PACKAGED DEVICES
CHIP
T
A
V
IO
max
AT 25°C
SMALL
OUTLINE
†
(D)
SSOP
‡
(DB)
CHIP
CARRIER
(FK)
CERAMIC DIP
(JG)
PLASTIC DIP
(P)
TSSOP
‡
(PW)
CHIP
FORM
§
(Y)
0°C to 200
μ
V TLE2021ACD
TLE2021CDBLE
TLE2021ACP
— —
0 C to
70°C
200 μV
500 μV
TLE2021ACD
TLE2021CD
TLE2021CDBLE — —
TLE2021ACP
TLE2021CP
TLE2021CPWLE TLE2021Y
−40°C
to
200
μ
V TLE2021AID
TLE2021AIP
to
85°C
200 μV
500 μV
TLE2021AID
TLE2021ID
— — —
TLE2021AIP
TLE2021IP
— —
−55°C
100 V
TLE2021BMFK
TLE2021BMJG
−
55 C
to
100 μV
500 μV
—
TLE2021MD
—
TLE2021BMFK
TLE2021MFK
TLE2021BMJG
TLE2021MJG
—
TLE2021MP
— —
to
125°C
500 μV TLE2021MD TLE2021MFK TLE2021MJ
G
TLE2021MP
†
The D packages are available taped and reeled. To order a taped and reeled part, add the suffix R (e.g., TLE2021CDR).
‡
The DB and PW packages are only available left-end taped and reeled.
§
Chip forms are tested at 25°C only.
TLE2022 AVAILABLE OPTIONS
PACKAGED DEVICES
CHIP
T
A
V
IO
max
AT 25°C
SMALL
OUTLINE
†
(D)
SSOP
‡
(DB)
CHIP
CARRIER
(FK)
CERAMIC
DIP
(JG)
PLASTIC
DIP
(P)
TSSOP
‡
(PW)
CHIP
FORM
§
(Y)
0°C
to
150 μV
300 μV
TLE2022BCD
TLE2022ACD
—
—
TLE2022ACP
— —
to
70°C
300 μV
500 μV
TLE2022ACD
TLE2022CD
—
TLE2022CDBLE
— —
TLE2022ACP
TLE2022CP
—
TLE2022CPWLE
—
TLE2022Y
−40°C
to
150 μV
300 μV
TLE2022BID
TLE2022AID
—
TLE2022AIP
to
85°C
300 μV
500 μV
TLE2022AID
TLE2022ID
— — —
TLE2022AIP
TLE2022IP
— —
−55°C 150
μ
V — — TLE2022BMJG —−
55 C
to
150 μV
300 μV
—
TLE2022AMD
—
—
TLE2022AMFK
TLE2022BMJG
TLE2022AMJG
—
TLE2022AMP
— —
to
125°C
300 μV
500 μV
TLE2022AMD
TLE2022MD
TLE2022AMFK
TLE2022MFK
TLE2022AMJG
TLE2022MJG
TLE2022AMP
TLE2022MP
†
The D packages are available taped and reeled. To order a taped and reeled part, add the suffix R (e.g., TLE2022CDR).
‡
The DB and PW packages are only available left-end taped and reeled.
§
Chip forms are tested at 25°C only.
TLE2024 AVAILABLE OPTIONS
PACKAGED DEVICES
CHIP
T
A
V
IO
max
AT 25°C
SMALL
OUTLINE
(DW)
CHIP
CARRIER
(FK)
CERAMIC
DIP
(J)
PLASTIC
DIP
(N)
CHIP
FORM
§
(Y)
500
μ
V TLE2024BCDW TLE2024BCN —
0°C to 70°C
500 μV
750 μV
TLE2024BCDW
TLE2024ACDW
— —
TLE2024BCN
TLE2024ACN
—
—
0 C to 70 C
750 μV
1000 μV
TLE2024ACDW
TLE2024CDW
TLE2024ACN
TLE2024CN TLE2024Y
500
μ
V TLE2024BIDW TLE2024BIN
−40°C to 85°C
500 μV
750 μV
TLE2024BIDW
TLE2024AIDW
— —
TLE2024BIN
TLE2024AIN
—
40 C to 85 C
750 μV
1000 μV
TLE2024AIDW
TLE2024IDW
TLE2024AIN
TLE2024IN
500
μ
V TLE2024BMDW TLE2024BMFK TLE2024BMJ TLE2024BMN
−55°C to 125°C
500 μV
750 μV
TLE2024BMDW
TLE2024AMDW
TLE2024BMFK
TLE2024AMFK
TLE2024BMJ
TLE2024AMJ
TLE2024BMN
TLE2024AMN
—
55 C to 125 C
750 μV
1000 μV
TLE2024AMDW
TLE2024MDW
TLE2024AMFK
TLE2024MFK
TLE2024AMJ
TLE2024MJ
TLE2024AMN
TLE2024MN
§
Chip forms are tested at 25°C only.
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