Datasheet 搜索 > 放大器、缓冲器 > TI（德州仪器） > TLE2024AIN 数据手册 > TLE2024AIN 数据手册 5/80 页
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TLE2024AIN 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
放大器、缓冲器
封装:
PDIP-14
描述:
神剑高速低功耗精密运算放大器 EXCALIBUR HIGH-SPEED LOW-POWER PRECISION OPERATIONAL AMPLIFIERS
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P4P5P6Hot
封装尺寸在P56P57P58P59P60P61P62P63P66P67P73
焊盘布局在P74
标记信息在P56P57P58P59P60P61P62P63P64
封装信息在P56P57P58P59P60P61P62P63P64P65P66P67
应用领域在P65P80
导航目录
TLE2024AIN数据手册
Page:
of 80 Go
若手册格式错乱，请下载阅览PDF原文件
TLE202x, TLE202xA, TLE202xB, TLE202xY
EXCALIBUR HIGH-SPEED LOW-POWER PRECISION
OPERATIONAL AMPLIFIERS
SLOS191D − FEBRUARY 1997 − REVISED NOVEMBER 2010
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TLE2022Y chip information
This chip, when properly assembled, displays characteristics similar to TLE2022. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. This chip may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4 × 4 MILS MINIMUM
T
J
max = 150°C
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED
TO
BACKSIDE
OF
CHIP.
+
−
OUT
IN +
IN−
V
CC+
(8)
(6)
(3)
(2)
(5)
(1)
−
+
(7)
IN +
IN−
OUT
(4)
V
CC −
80
86
(1)
(2)
(3)
(4)
(5)
(6)(7)
(8)
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