Datasheet 搜索 > 运算放大器 > TI（德州仪器） > TLV2472AIDR 数据手册 > TLV2472AIDR 数据手册 3/64 页
器件3D模型￥ 9.895
TLV2472AIDR 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
运算放大器
封装:
SOIC-8
描述:
FAMILY 600毫安/通道280 MHz的轨到轨输入/输出高驱动运算放大器，带有关断 FAMILY OF 600-mA/Ch 2.8-MHz RAIL-TO-RAIL INPUT/OUTPUT HIGH-DRIVE OPERATIONAL AMPLIFIERS WITH SHUTDOWN
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
封装尺寸在P3P23P24P25P26P27P28P30P31P32P33
标记信息在P23P24P25P26P27P28P29
封装信息在P1P2P23P24P25P26P27P28P29P30P31P32
技术参数、封装参数在P4
应用领域在P64
电气规格在P5P6P7P8
导航目录
TLV2472AIDR数据手册
Page:
of 64 Go
若手册格式错乱，请下载阅览PDF原文件
www.ti.com
TLV247X PACKAGE PINOUTS
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
1OUT
1IN−
1IN+
V
DD
2IN+
2IN−
2OUT
1/2SHDN
4OUT
4IN−
4IN+
GND
3IN+
3IN−
3OUT
3/4SHDN
(TOP VIEW)
TLV2475
D, N, OR PWP PACKAGE
1
2
3
4
5
10
9
8
7
6
1OUT
1IN−
1IN+
GND
1SHDN
V
DD
2OUT
2IN−
2IN+
2SHDN
3
2
4
5
(TOP VIEW)
1
OUT
GND
IN+
V
DD
IN−
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1OUT
1IN−
1IN+
GND
NC
1SHDN
NC
V
DD
2OUT
2IN−
2IN+
NC
2SHDN
NC
(TOP VIEW)
TLV2471
DBV PACKAGE
3
2
4
6
(TOP VIEW)
1
OUT
GND
IN+
V
DD
IN−
TLV2470
DBV PACKAGE
5
SHDN
1
2
3
4
8
7
6
5
NC
IN−
IN+
GND
SHDN
V
DD
OUT
NC
TLV2470
D OR P PACKAGE
(TOP VIEW)
1
2
3
4
8
7
6
5
NC
IN−
IN+
GND
NC
V
DD
OUT
NC
TLV2471
D OR P PACKAGE
(TOP VIEW)
1
2
3
4
8
7
6
5
1OUT
1IN−
1IN+
GND
V
DD
2OUT
2IN−
2IN+
TLV2472
D, DGN, OR P PACKAGE
(TOP VIEW)
TLV2473
DGQ PACKAGE
(TOP VIEW)
TLV2473
D OR N PACKAGE
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1OUT
1IN−
1IN+
V
DD
2IN+
2IN−
2OUT
4OUT
4IN−
4IN+
GND
3IN+
3IN−
3OUT
(TOP VIEW)
TLV2474
D, N, OR PWP PACKAGE
NC − No internal connection
Printed or
Molded Dot
Beveled Edges
Pin 1
Molded U Shape
Pin 1
Stripe
Pin 1
Pin 1
TLV2470 , , TLV2471
TLV2472 , TLV2473
TLV2474 , TLV2475 , TLV247xA
SLOS232E – JUNE 1999 – REVISED JULY 2007
TYPICAL PIN 1 INDICATORS
3
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