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TPS24750EVM-546 数据手册 - TI（德州仪器）
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TPS24750EVM-546数据手册
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TPS24750
,
TPS24751
www.ti.com
SLVSC87A –OCTOBER 2013–REVISED SEPTEMBER 2015
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range, all voltages referred to GND (unless otherwise noted)
MIN MAX UNIT
DRAIN, EN, FLTb
(1)
, GATE, OUT, PGb
(1)
, SENSE, SET
(1)
, VCC –0.3 30
OV –0.3 20
Input voltage range PROG
(1)
–0.3 3.6 V
[SET, SENSE] to VCC –0.3 0.3
IMON, TIMER –0.3 5
Sink current FLTb, PGb 5 mA
PROG Internally limited
Source current
IMON 5 mA
Temperature Maximum junction, T
J
150 °C
Storage temperature, T
STG
–65 150 °C
(1) Do not apply voltage directly to these pins.
7.2 ESD Ratings
VALUE UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±500
V
(ESD)
Electrostatic discharge V
Charged-device model (CDM), per JEDEC specification JESD22-
±500
C101
(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
OV 0 16
Input voltage range SENSE, SET
(1)
, VCC
(2)
2.5 18 V
EN, FLTb, GATE
(2)
, PGb, OUT
(2)
, DRAIN
(2)
0 18
Sink current FLTb, PGb 0 2 mA
Source current IMON 0 1 mA
Resistance PROG 4.99 500 kΩ
TIMER 1 nF
External capacitance
GATE
(3)
1 µF
Operating junction temperature range, T
J
–40 125 °C
(1) Do not apply voltage directly to these pins.
(2) Refer Application section Gate Clamp Diode for additional precaution to be taken for operating voltages >14 V.
(3) External capacitance tied to GATE should be in series with a resistor no less than 1 kΩ.
7.4 Thermal Information
TPS2475x
THERMAL METRIC
(1)
RUV (VQFN) UNIT
36 PINS
R
θJA
Junction-to-ambient thermal resistance 33.7 °C/W
R
θJC(top)
Junction-to-case (top) thermal resistance 28.2 °C/W
R
θJB
Junction-to-board thermal resistance 5.8 °C/W
ψ
JT
Junction-to-top characterization parameter 0.3 °C/W
ψ
JB
Junction-to-board characterization parameter 5.7 °C/W
R
θJC(bot)
Junction-to-case (bottom) thermal resistance 1.1 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953b.
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