Datasheet 搜索 > 电压监控芯片 > TI（德州仪器） > TPS3702CX50QDDCRQ1 数据手册 > TPS3702CX50QDDCRQ1 数据手册 4/28 页
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TPS3702CX50QDDCRQ1 数据手册 - TI（德州仪器）
制造商:
TI（德州仪器）
分类:
电压监控芯片
封装:
TSOT-23-6
描述:
用于过压和欠压监测的汽车类高精度窗口电压检测器 6-SOT-23-THIN -40 to 125
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
引脚图在P3Hot
典型应用电路图在P1P17
原理图在P10P14
封装尺寸在P22P24P25
标记信息在P22P23
封装信息在P21P22P23P24P25
技术参数、封装参数在P4P11
应用领域在P1P28
电气规格在P5P11
导航目录
TPS3702CX50QDDCRQ1数据手册
Page:
of 28 Go
若手册格式错乱，请下载阅览PDF原文件
TPS3702-Q1
SBVS261B –APRIL 2015–REVISED DECEMBER 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
V
DD
–0.3 20 V
Voltage V
UV
, V
OV
–0.3 20 V
V
SENSE
, V
SET
–0.3 7 V
Current I
UV
, I
OV
±40 mA
Continuous total power dissipation See the Thermal Information
Operating junction temperature, T
J
(2)
–40 150 °C
Storage temperature, T
stg
–65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) As a result of the low dissipated power in this device, it is assumed that T
J
= T
A
.
6.2 ESD Ratings
VALUE UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±2000
V
(ESD)
Electrostatic discharge V
Charged device model (CDM), per JEDEC specification JESD22-C101
(2)
±750
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
V
DD
Supply pin voltage 2 18 V
V
SENSE
Input pin voltage 0 6.5 V
V
SET
SET pin voltage 0 6.5 V
V
UV
, V
OV
Output pin voltage 0 18 V
I
UV
, I
OV
Output pin current 0.3 10 mA
R
PU
Pull-up resistor 2.2 10,000 kΩ
6.4 Thermal Information
TPS3702-Q1
THERMAL METRIC
(1)
DDC (SOT) UNIT
6 PINS
R
θJA
Junction-to-ambient thermal resistance 201.6 °C/W
R
θJC(top)
Junction-to-case (top) thermal resistance 47.8 °C/W
R
θJB
Junction-to-board thermal resistance 51.2 °C/W
ψ
JT
Junction-to-top characterization parameter 0.7 °C/W
ψ
JB
Junction-to-board characterization parameter 50.8 °C/W
R
θJC(bot)
Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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