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OFF ON
SW G SW
OFF GATE ON GATE
R R
P 0.5 Q VDD f
R R R R
æ ö
= ´ ´ ´ ´ +
ç ÷
+ +
è ø
UCC27511
,
UCC27512
SLUSAW9F FEBRUARY 2012REVISED NOVEMBER 2014
www.ti.com
Typical Application (continued)
This power P
G
is dissipated in the resistive elements of the circuit when the MOSFET/IGBT is being turned on or
off. Half of the total power is dissipated when the load capacitor is charged during turnon, and the other half is
dissipated when the load capacitor is discharged during turnoff. When no external gate resistor is employed
between the driver and MOSFET/IGBT, this power is completely dissipated inside the driver package. With the
use of external gate-drive resistors, the power dissipation is shared between the internal resistance of driver and
external gate resistor in accordance to the ratio of the resistances (more power dissipated in the higher
resistance component). Based on this simplified analysis, the driver power dissipation during switching is
calculated in Equation 5.
where
R
OFF
= R
OL
R
ON
(effective resistance of pull-up structure) = 2.7 x R
OL
(5)
10.2.3 Application Curves
Figure 27 and Figure 28 show the typical switching characteristics of the UCC27511 device.
V
DD
= 10 V C
(LOAD)
= 1 nF V
DD
= 10 V C
(LOAD)
= 1 nF
Figure 27. Typical Turnon Waveform Figure 28. Typical Turnoff Waveform
26 Submit Documentation Feedback Copyright © 2012–2014, Texas Instruments Incorporated
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UCC27511DBVR 数据手册

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UCC27511 数据手册

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