Datasheet 搜索 > 工业继电器/通用 > TE Connectivity（泰科） > V23026A1002B201 数据手册 > V23026A1002B201 数据手册 4/5 页
￥ 49.373
V23026A1002B201 数据手册 - TE Connectivity（泰科）
制造商:
TE Connectivity（泰科）
分类:
工业继电器/通用
封装:
DIP
描述:
P1 印刷电路板继电器，单稳态和双稳态极化直接电压继电器 单稳态和双稳态，带 1 或 2 线圈 用于安装在按下开关（栅距2.54 mm） PIN 和 SMD 型号 双触点 超紧凑型（最大表面积 1.07 cm2） 高灵敏度 直接 TTL 模块控制 防水 **经 UL、CSA、CECC 认证** 描述 | 额定电压 V 直流 | 电压范围（20 °C V 直流时） | 线圈电阻，20 °C 时 ±10% ---|---|---|--- V23026-A1001-B201 | 5 | 3.75 → 14.5 V | 370 Ω V23026-A1002-B201 | 12 | 9 → 35 V | 2250 Ω V23026-A1003-B201 | 15 | 11.25 → 42 V | 3100 Ω V23026-A1004-B201 | 24 | 18 → 50 V | 4500 Ω V23026-C1051-B201 | 5 | 3.75 → 20 V | 740 Ω 触点： | 1 个转换开关 ---|--- 触点材料： | Pd Ni，Au Rh 涂层 限制连续电流： | 1 A 最大切换电流： | 1 A 最大切换电压 | 150 V 直流，125 V 交流 最大切换能力： | 30, 60 VA 容量 | 单稳态： | 1 W. 65 → 130 mW 双稳态： | 1 W. 30 → 130 mW 标称 电压： | 5 → 24 V 之路 响应电压： | 最大 75% 额定电压 允许的环境温度： | -40 °C → +70 °C 保护等级： | 防水，IP67 型号尺寸： | 13 ´ 7.62 ´ 6.9 mm (PIN) ### TE Connectivity展开
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
典型应用电路图在P1
封装信息在P2P4
焊接温度在P4
技术参数、封装参数在P1
导航目录
V23026A1002B201数据手册
Page:
of 5 Go
若手册格式错乱，请下载阅览PDF原文件
02-2012, Rev. 0212
www.te.com
© 2011 Tyco Electronics Corporation,
a TE Connectivity Ltd. company
Datasheets and product specification
according to IEC 61810-1 and to be used
only together with the ‘Definitions’ section.
Datasheets and product data is subject to the
terms of the disclaimer and all chapters of
the ‘Definitions’ section, available at
http://relays.te.com/definitions
Datasheets, product data, ‘Definitions’ sec-
tion, application notes and all specifications
are subject to change.
4
AXICOM
Signal Relays
P1 Relay V23026
(Continued)
Recommended soldering conditions
Processing
108-98009 Rev. E
All specifications subject to change. Consult Tyco Electronics for latest specifications.
9 of 12
Telecom-, Signal and RF Relays
P1 V23026 Relay
AXICOM
Soldering conditions according IEC 60058-2-58 and
IPC/JEDEC J-STD-020B
Infrared Soldering: Temperature/Time Profile
(Lead and Housing Peak Temperature)
Infrared Soldering: Temperature/Time Profile
(Lead and Housing Peak Temperature)
Recommended Soldering Conditions
Resistance to soldering heat - Reow prole
Recommended reow soldering prole
Vapor Phase Soldering: Temperature/Time Profile
(Lead and Housing Peak Temperature)
240 °C
180 °C
130 °C
100 °C
20 - 40 sec
Full line: typical
Dotted line: process limits
forced
cooling
Temperature °C
Temperature °C
Time (s)
Temperature °C
Time (s)
108-98009 Rev. E
All specifications subject to change. Consult Tyco Electronics for latest specifications.
9 of 12
Telecom-, Signal and RF Relays
P1 V23026 Relay
AXICOM
Soldering conditions according IEC 60058-2-58 and
IPC/JEDEC J-STD-020B
Infrared Soldering: Temperature/Time Profile
(Lead and Housing Peak Temperature)
Infrared Soldering: Temperature/Time Profile
(Lead and Housing Peak Temperature)
Recommended Soldering Conditions
Resistance to soldering heat - Reow prole
Recommended reow soldering prole
Vapor Phase Soldering: Temperature/Time Profile
(Lead and Housing Peak Temperature)
240 °C
180 °C
130 °C
100 °C
20 - 40 sec
Full line: typical
Dotted line: process limits
forced
cooling
Temperature °C
Temperature °C
Time (s)
Temperature °C
Time (s)
108-98009 Rev. E
All specifications subject to change. Consult Tyco Electronics for latest specifications.
9 of 12
Telecom-, Signal and RF Relays
P1 V23026 Relay
AXICOM
Soldering conditions according IEC 60058-2-58 and
IPC/JEDEC J-STD-020B
Infrared Soldering: Temperature/Time Profile
(Lead and Housing Peak Temperature)
Infrared Soldering: Temperature/Time Profile
(Lead and Housing Peak Temperature)
Recommended Soldering Conditions
Resistance to soldering heat - Reow prole
Recommended reow soldering prole
Vapor Phase Soldering: Temperature/Time Profile
(Lead and Housing Peak Temperature)
240 °C
180 °C
130 °C
100 °C
20 - 40 sec
Full line: typical
Dotted line: process limits
forced
cooling
Temperature °C
Temperature °C
Time (s)
Temperature °C
Time (s)
Soldering conditions according IEC 60058-2-58 and
IPC/JEDEC J-STD-020B
Resistance to soldering heat - Reflow profile
Recommended reflow soldering profile
Vapor Phase Soldering:
temperature/time profile (lead
and housing peak temperature)
Infrared Soldering: temperature/
time profile (lead and housing
peak temperature)
Packing
108-98009 Rev. E
All specifications subject to change. Consult Tyco Electronics for latest specifications.
10 of 12
Telecom-, Signal and RF Relays
P1 V23026 Relay
AXICOM
Packing
Dimensions in mm
11.6±0.2
13.8±0.2
Tube for THT version
40 relays per tube
2‘000 relays per box
Tape and reel for SMT version
480 relays per reel
2‘400 per box
Reel dimension
Tube for THT version
40 relays per tube, 2000 relays per box
108-98009 Rev. E
All specifications subject to change. Consult Tyco Electronics for latest specifications.
10 of 12
Telecom-, Signal and RF Relays
P1 V23026 Relay
AXICOM
Packing
Dimensions in mm
11.6±0.2
13.8±0.2
Tube for THT version
40 relays per tube
2‘000 relays per box
Tape and reel for SMT version
480 relays per reel
2‘400 per box
Reel dimension
Tape and reel for SMT version
480 relays per reel, 2400 relays per box
Reel dimensions
108-98009 Rev. E
All specifications subject to change. Consult Tyco Electronics for latest specifications.
10 of 12
Telecom-, Signal and RF Relays
P1 V23026 Relay
AXICOM
Packing
Dimensions in mm
11.6±0.2
13.8±0.2
Tube for THT version
40 relays per tube
2‘000 relays per box
Tape and reel for SMT version
480 relays per reel
2‘400 per box
Reel dimension
108-98009 Rev. E
All specifications subject to change. Consult Tyco Electronics for latest specifications.
10 of 12
Telecom-, Signal and RF Relays
P1 V23026 Relay
AXICOM
Packing
Dimensions in mm
11.6±0.2
13.8±0.2
Tube for THT version
40 relays per tube
2‘000 relays per box
Tape and reel for SMT version
480 relays per reel
2‘400 per box
Reel dimension
器件 Datasheet 文档搜索
AiEMA 数据库涵盖高达 72,405,303 个元件的数据手册，每天更新 5,000 多个 PDF 文件
