AD5693BCPZ-RL7 产品修订记录 - ADI（亚德诺）

Product/Process Change Notice - PCN 16_0036 Rev. C

Analog Devices, Inc. Three Technology Way Norwood, Massachusetts 02062-9106

This notice is to inform you of a change that will be made to certain ADI products (see Appendix A) that you may have purchased in the

last 2 years. Any inquiries or requests with this PCN (additional data or samples) must be sent to ADI within 30 days of

publication date. ADI contact information is listed below.

Note: Revised fields are indicated by a red field name. See Appendix B for revision history.

PCN Title: Assembly Relocation to Stats ChipPAC Jiangyin and Test Transfer to Stats ChipPAC

Singapore of Select LFCSP Products

Description Of Change

The assembly of select LFCSP, Mini LFCSP and Side Solderable LFCSP products is relocating from STATS ChipPAC China Shanghai to

STATS ChipPAC China Jiangyin. The testing will transfer from STATS ChipPAC China Shanghai to STATS ChipPAC Singapore. The package

outline dimensions and BOM of each product will be maintained.

Reason For Change

ADI Assembly is transferring to STATS ChipPAC China Jiangyin and Test will move to STATS ChipPAC Singapore due to the relocation of

STATS ChipPAC China Shanghai at the end of September 2017.

ADI's assembly and test subcontractors manufacture products using Analog Devices specified manufacturing flows, materials, process

controls and monitors, ensuring the same level of quality and reliability on products they receive from the new site.

Summary of Supporting Information

Qualifications are completed per AEC-Q100, Stress Test Qualification for Integrated Circuits. See attached Qualification Results. Test

Correlation and validation will be performed, see the attached Test Qual Plan.

Comments

This applies for all packing/reel options.

During the transition to the New Assembly and Test Site, products will be Assembled and Tested from the either Current or New Assembly

and Test Site.

Example: SCC Assembly and Test to SC3 Assembly and STA Test,