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AD7689BCPZ 产品修订记录 - ADI（亚德诺）
制造商:
ADI（亚德诺）
分类:
AD转换器
封装:
LFCSP-20
描述:
ANALOG DEVICES AD7689BCPZ 模数转换器, 八路 MUX, 16 bit, 250 kSPS, 单, 2.3 V, 5.5 V, LFCSP
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AD7689BCPZ数据手册
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Product/Process Change Notice - PCN 14_0020 Rev. C
Analog Devices, Inc. Three Technology Way Norwood, Massachusetts 02062-9106
This notice is to inform you of a change that will be made to certain ADI products (see Material Report). Any issues with this PCN or
requirements to qualify the change (additional data or samples) must be sent to ADI within 30 days of publication date. ADI contact
information is listed below.
Note: Revised fields are indicated by a red field name. See Appendix B for revision history.
PCN Title: Conversion of 4x4mm body Size LFCSP Package Outlines from Punch to Sawn and
Transfer of Assembly Site to Amkor Philippines.
Publication Date: 22-Dec-2014
Effectivity Date: 22-Mar-2015 (the earliest date that a customer could expect to receive changed material)
Revision Description:
Add Parts
Description Of Change
ADI has qualified and will be utilizing Assembly subcontractor Amkor in Philippines for 4x4mm body size LFCSP products. ADI has also
qualified Amkor's standard bill of materials in a SAWN singulated leadframe. There will be no change in BOM. Pin1 indicator will be laser
marked as part of the change. See attached for changes and package outline differences.
Reason For Change
Sawn LFCSP is ADI's technology direction for LFCSP. The use of ADI qualified Amkor-Philippines as an assembly site will ensure continued
source of product supply. ADI's assembly subcontractors manufacture our products using Analog Devices specified manufacturing flows,
process controls and monitors. This assures that our customers receive the same level of quality and reliability on products they receive
from qualified ADI manufacturing locations.
Impact of the change (positive or negative) on fit, form, function & reliability
The devices function and reliability as specified by the product datasheet will be unaffected by these changes. The Lead Foot Print Dimension
will remain the same for both punch and sawn LFCSP packages
Summary of Supporting Information
Qualification has been performed per ADI0012, Procedure for Qualification of New or Revised Processes. See attached Qualification Report
Summary.
Supporting Documents
Attachment 1: Type: Qualification Results Summary
ADI_PCN_14_0020_Rev_C_Qualification Summary.pdf
Attachment 2: Type: Detailed Change Description
ADI_PCN_14_0020_Rev_C_Materials and Package Configuration.pdf
Attachment 3: Type: Package Outline Drawing
Analog Devices, Inc. PCN 14_0020_Rev_C Page 1 of 5
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