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器件3D模型￥ 31.703
AD8339ACPZ 产品修订记录 - ADI（亚德诺）
制造商:
ADI（亚德诺）
分类:
RF射频器件
封装:
LFCSP-40
描述:
ANALOG DEVICES AD8339ACPZ 芯片, 正交解调器
Pictures:
3D模型
符号图
焊盘图
引脚图
产品图
页面导航:
封装尺寸在P1
型号编号列表在P3P4
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AD8339ACPZ数据手册
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Product/Process Change Notice - PCN 16_0077 Rev. A
Analog Devices, Inc. Three Technology Way Norwood, Massachusetts 02062-9106
This notice is to inform you of a change that will be made to certain ADI products (see Appendix A) that you may have purchased in the
last 2 years. Any inquiries or requests with this PCN (additional data or samples) must be sent to ADI within 30 days of
publication date. ADI contact information is listed below.
Note: Revised fields are indicated by a red field name. See Appendix B for revision history.
PCN Title: Conversion of Select 4x4, 5x5, 6x6 and 7x7mm LFCSP Package Outlines from Punch
to Sawn and Transfer of Assembly Site to ASE Korea.
Publication Date: 26-Aug-2016
Effectivity Date: 24-Nov-2016 (the earliest date that a customer could expect to receive changed material)
Revision Description:
Package Outline Drawing(POD) attachment updated to correct POD spec and pad size. Added list of parts affected by the corrected POD
changes. Added POD overlay. Added parts.
Description Of Change
ADI has qualified and will be utilizing Assembly subcontractor ASE in Korea for LFCSP products in 4x4, 5x5, 6x6 and 7x7mm packages. ADI
has also qualified ASE's standard bill of materials in a SAWN singulated leadframe. See attached for BOM changes, package outline and pin
one ID differences.
Reason For Change
Sawn LFCSP is ADI's technology direction for LFCSP. The use of ADI qualified ASE-Korea as an assembly site will ensure continued source
of product supply. ADI's assembly subcontractors manufacture our products using Analog Devices specified manufacturing flows, process
controls and monitors. This assures that our customers receive the same level of quality and reliability on products they receive from
qualified ADI manufacturing locations.
Impact of the change (positive or negative) on fit, form, function & reliability
The devices function and reliability as specified by the product datasheet will be unaffected by these changes. The Foot Print Dimension will
remain the same for both punch and sawn LFCSP packages.
Summary of Supporting Information
Qualification has been performed per Industry Standard Test Methods. See attached Qualification Results Summary.
Supporting Documents
Attachment 1: Type: Detailed Change Description
ADI_PCN_16_0077_Rev_A_POD rev_Pin One_Bill Of Material Changes_.pdf
Attachment 2: Type: Package Outline Drawing
ADI_PCN_16_0077_Rev_A_POD overlay.pdf
Attachment 3: Type: Detailed Parts List
ADI_PCN_16_0077_Rev_A_parts affected by POD Spec Pad Size Change.xlsx
Analog Devices, Inc. PCN 16_0077_Rev_A Page 1 of 5
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