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EP3C5F256I7N
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EP3C5F256I7N数据手册
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Altera Corporation 06/10/2010 PCN0904
1
P
P
R
R
O
O
C
C
E
E
S
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C
C
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H
A
A
N
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E
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F
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I
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0
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4
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Cyclone
®
III Family Process Shrink from 65-nm to 60-nm and
Package Bill of Material Change
Change Description
This is an update to PCN0904, please see revision history table for information specific to this
update.
Altera is transitioning Cyclone
®
III products from a 65-nm to a 60-nm process at TSMC Fab 14. In
addition to the change in technology node, BGA packages out of Amkor will transition from a 4-
layer to 2-layer or from a 6-layer to 4-layer substrate design. Packages with leadframe designs will
remain unchanged. All package types will transition from gold (Au) to copper (Cu) wire. There is
no change to the package-outline drawings. The new packages are halogen free, EU-RoHS
compliant, and do not contain published REACH SvHC. Altera will continue to support packages
assembled with tin lead (SnPb) solder balls and leadframe plating.
Recommended Action
There is no change to form, fit, or function as defined in Altera’s datasheet. Altera recommends
that customers review the electrical characterization report to determine if any action is required
for their application.
Reason for Change
Altera is implementing this process change to improve manufacturing efficiency and to enable
Altera to better support long-term demand for the affected products. TSMC and Amkor are
existing, fully qualified strategic manufacturing partners for Altera products. The substrate designs
are being migrated to current substrate-routing technologies. Conversion to copper wire is aligned
with the current industry trend. Copper wire is used in high-volume production by our assembly
vendors and has demonstrated better electrical and mechanical properties than gold.
Altera is committed to conducting its business operations in a manner that sustains the
environment. This includes maintaining the compliance of Altera products to applicable
environmental regulations. The conversion to halogen-free packages is in alignment with known
regulatory trends for the semiconductor industry.
Revision: 1.2.0

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