Datasheet 搜索 > FPGA芯片 > Altera（阿尔特拉） > EP3C5F256I7N 数据手册 > EP3C5F256I7N 产品封装文件 2/8 页
器件3D模型￥ 300.499
EP3C5F256I7N 产品封装文件 - Altera（阿尔特拉）
制造商:
Altera（阿尔特拉）
分类:
FPGA芯片
封装:
FBGA-256
描述:
可编程逻辑器件(CPLD/FPGA) EP3C5F256I7N BGA-256
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型号编码规则在P7P8
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EP3C5F256I7N数据手册
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Altera Corporation 06/10/2010 PCN0904
2
TSMC’s 60-nm fabrication process is fully qualified and meets Altera’s quality and reliability
requirements. The change to 60-nm process, reduced substrate layers for BGA packages, and
copper wire has been validated through successful completion of full qualification per JEDEC
requirements. Supporting reliability data are included in this notification.
Products Affected
The initial product lines affected by this change are listed in Table 1. A list of ordering part
numbers is included in Appendix 1.
Table 1: Affected Product Lines
Product
Line
Pin
Count
Package
Type
Sample
Availability
Earliest
Shipment
EP3C120 484 FBGA Dec 2009 Feb 2010
EP3C120 780 FBGA Dec 2009 Feb 2010
EP3C80 484 FBGA Jan 2010 Apr 2010
EP3C80 780 FBGA Jan 2010 Apr 2010
EP3C80 484 UBGA Jan 2010 Apr 2010
EP3C55 484 FBGA Jan 2010 Apr 2010
EP3C55 780 FBGA Jan 2010 Apr 2010
EP3C55 484 UBGA Jan 2010 Apr 2010
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