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EPF10K20RI208-4 产品封装文件 - Altera（阿尔特拉）
制造商:
Altera（阿尔特拉）
分类:
FPGA芯片
封装:
RQFP-208
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引脚图
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EPF10K20RI208-4数据手册
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若手册格式错乱，请下载阅览PDF原文件
Altera Corporation 06/30/2010 PCN1002
1
P
P
R
R
O
O
C
C
E
E
S
S
S
S
C
C
H
H
A
A
N
N
G
G
E
E
N
N
O
O
T
T
I
I
F
F
I
I
C
C
A
A
T
T
I
I
O
O
N
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P
P
C
C
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1
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0
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0
0
2
2
Additional Assembly Source and Power Quad Flat Pack (RQFP)
208 and 240 Package Conversion
Change Description
Altera is introducing Amkor, Philippines (ATP) as an additional assembly source for the RQFP 208
and 240 packages. ATP will become the primary source and is an existing qualified assembly site
for Altera devices. In addition, the Power Quad Flat Pack (RQFP) package will transition from the
PowerQuad
®
2 (PQ2) to the PowerQuad
®
4 (PQ4) package.
Recommended Action
Altera recommends that customers review their device thermal performance to determine if action
is required for their application. Thermal resistance (Theta ja) for the PQ4 package design is
approximately 1.5°C to 2.0°C / watt higher than the existing design. The package top side
appearance will be different as the heat slug will change from nickel (Ni) plated Cu to Anodized
Aluminum (Al).
Reason for Change
Altera is implementing this package change to better support long-term demand for the affected
products. The PQ2 package design is being discontinued and conversion to the PQ4 package is
essential for continued support. Amkor is an existing, fully qualified assembly manufacturer for
Altera products.
The RQFP PQ4 package is fully qualified and meets Altera’s quality and reliability requirements.
Supporting reliability data are included in this notification.
Revision: 1.0.0
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