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FAN54015UCX 其他数据使用手册 - Fairchild（飞兆/仙童）
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FAN54015UCX数据手册
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© 2012 Fairchild Semiconductor Corporation www.fairchildsemi.com
FAN54040 – FAN54047 • Rev. 1.3 5
FAN54040 - FAN54047— USB-OTG,1.55 A Li-Ion Switching Charger with Power Path and 2.3 A Production Test Support
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable
above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition,
extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute
maximum ratings are stress ratings only.
Symbol
Parameter
Min.
Max.
Unit
V
BUS
Voltage on VBUS Pin
Continuous
-0.3
28.0
V
Pulsed, 100 ms Maximum Non-Repetitive
-1.0
V
I
Voltage on PMID Voltage Pin
–0.3
7.0
V
Voltage on SW, SYS, VBAT, STAT, DIS Pins
–0.3
7.0
V
O
Voltage on Other Pins
–0.3
6.5
(3)
V
dt
dV
BUS
Maximum V
BUS
Slope Above 5.5 V when Boost or Charger Active
4
V/s
ESD
Electrostatic Discharge
Protection Level
Human Body Model per JESD22-A114
2000
V
Charged Device Model per JESD22-C101
500
IEC 61000-4-2 System ESD
(4)
USB Connector
Pins (V
BUS
to GND)
Air Gap
15
kV
Contact
8
T
J
Junction Temperature
–40
+150
°C
T
STG
Storage Temperature
–65
+150
°C
T
L
Lead Soldering Temperature, 10 Seconds
+260
°C
Note:
3. Lesser of 6.5 V or V
I
+ 0.3 V.
4. Guaranteed if C
BUS
≥1 µF and C
MID
≥ 4. 7µF.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating
conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend
exceeding them or designing to absolute maximum ratings.
Symbol
Parameter
Min.
Max.
Unit
V
BUS
Supply Voltage
4
6
V
V
BAT(MAX)
Maximum Battery Voltage when Boost enabled
4.5
V
dt
dV
BUS
Negative VBUS Slew Rate during VBUS Short Circuit,
C
MID
< 4.7 µF, see VBUS Short While Charging
T
A
< 60°C
4
V/s
T
A
> 60°C
2
T
A
Ambient Temperature
–30
+85
°C
T
J
Junction Temperature (see Thermal Regulation and Protection section)
–30
+120
°C
Thermal Properties
Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with four-layer
2s2p boards in accordance to JEDEC standard JESD51. Special attention must be paid not to exceed junction temperature
T
J(max)
at a given ambient temperature T
A
. For measured data, see Table 18.
Symbol
Parameter
Typical
Unit
JA
Junction-to-Ambient Thermal Resistance (see also Figure 18)
50
°C/W
JB
Junction-to-PCB Thermal Resistance
20
°C/W
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