Datasheet 搜索 > 运算放大器 > TI（德州仪器） > LM2902KVQPWRQ1 数据手册 > LM2902KVQPWRQ1 其他数据使用手册 1/14 页
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LM2902KVQPWRQ1 其他数据使用手册 - TI（德州仪器）
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TI（德州仪器）
分类:
运算放大器
封装:
TSSOP-14
描述:
翻两番运算放大器 QUADRUPLE OPERATIONAL AMPLIFIER
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LM2902KVQPWRQ1数据手册
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Texas Instruments Incorporated PCN 20161017001
PCN Number:
20161017001
PCN Date:
Nov. 2, 2016
Title:
New Assembly Materials For Select Automotive Devices in SOIC & TSSOP Package
Customer Contact:
PCN Manager
Dept:
Quality Services
Proposed 1
st
Ship Date:
May 2, 2017
Estimated Sample
Availability:
Date provided at
sample request
Change Type:
Assembly Site
Design
Wafer Bump Site
Assembly Process
Data Sheet
Wafer Bump Material
Assembly Materials
Part number change
Wafer Bump Process
Mechanical Specification
Test Site
Wafer Fab Site
Packing/Shipping/Labeling
Test Process
Wafer Fab Materials
Wafer Fab Process
PCN Details
Description of Change:
Texas Instruments is pleased to announce the qualification of new assembly material set to add Cu
as an additional bond wire option for devices listed in “Product affected” section below. Devices will
remain in current assembly facility and piece part changes as follows:
SOIC – Group 1
Material
Current
Additional Material
Wire (mil)
0.96 Au
1.0 Cu
Mount Compound
4042500, 4208458
4147858
Mold Compound
4205694, 4209640
4211880
`Leadframe Surface
Standard NiPdAu
Roughened NiPdAu
TSSOP - Group 2
Material
Current
Additional Material
Wire (mil)
0.8, 0.96, 1.15 Au
1.0 Cu
Mount Compound
4042500, 4208458,
4211470
4147858
Mold Compound
4209640, 4206193
4211471
Leadframe Surface
Standard NiPdAu
Roughened NiPdAu
Reason for Change:
Continuity of supply.
1) To align with world technology trends and use wiring with enhanced mechanical and electrical
properties.
2) Maximize flexibility within our Assembly/Test production sites.
3) Cu is easier to obtain and stock.
4) Reduced delamination risk. Enhanced part reliability.
Anticipated impact on Material Declaration:
No Impact to the
Material Declaration
Material Declarations or Product Content reports are driven
from production data and will be available following the
production release. Upon production release the revised
reports can be obtained from the TI ECO website.
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