Datasheet 搜索 > 稳压芯片 > ON Semiconductor（安森美） > LM317BTG 数据手册 > LM317BTG 产品设计图 1/2 页
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LM317BTG 产品设计图 - ON Semiconductor（安森美）
制造商:
ON Semiconductor（安森美）
分类:
稳压芯片
封装:
TO-220-3
描述:
LM317 线性稳压器，ON Semiconductor**ON Semiconductor LM317** 系列是可调线性稳压器。 3 端子正电压稳压器可提供 1.5A 及更高的输出电流，输出电压介于 1.2 至 37V 之间。 易于使用的 LM317 可调稳压器可用于各种应用，如卡式调节，并可用作可编程输出稳压器；通过在调整和输出之间连接一个固定电阻器，它可用作精密电流稳压器。 输出电压范围：1.25 V 至 37 V 输出电流：1.5 A 短路电流限制、热保护和安全区域补偿 浮动操作，用于高电压应用 ### 线性稳压器，On Semiconductor
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LM317BTG数据手册
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of 2 Go
若手册格式错乱，请下载阅览PDF原文件
SCALE 1:1
D
2
PAK
CASE 936−03
ISSUE E
DATE 29 SEP 2015
0
V
U
TERMINAL 4
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCHES.
3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS
A AND K.
4. DIMENSIONS U AND V ESTABLISH A MINIMUM
MOUNTING SURFACE FOR TERMINAL 4.
5. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH OR GATE PROTRUSIONS. MOLD FLASH
AND GATE PROTRUSIONS NOT TO EXCEED
0.025 (0.635) MAXIMUM.
6. SINGLE GAUGE DESIGN WILL BE SHIPPED
AFTER FPCN EXPIRATION IN OCTOBER 2011.
DIM
A
MIN MAX MIN MAX
MILLIMETERS
0.386 0.403 9.804 10.236
INCHES
B 0.356 0.368 9.042 9.347
C 0.170 0.180 4.318 4.572
D 0.026 0.036 0.660 0.914
E 0.045 0.055 1.143 1.397
F 0.051 REF 1.295 REF
G 0.100 BSC 2.540 BSC
H 0.539 0.579 13.691 14.707
J 0.125 MAX 3.175 MAX
K 0.050 REF 1.270 REF
L 0.000 0.010 0.000 0.254
M 0.088 0.102 2.235 2.591
N 0.018 0.026 0.457 0.660
P 0.058 0.078 1.473 1.981
R
S 0.116 REF 2.946 REF
U 0.200 MIN 5.080 MIN
V 0.250 MIN 6.350 MIN
_
A
12 3
K
F
B
J
S
H
D
M
0.010 (0.254) T
E
OPTIONAL
CHAMFER
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
8.380
5.080
DIMENSIONS: MILLIMETERS
PITCH
2X
16.155
1.016
2X
10.490
3.504
XXXXXXG
ALYWW
GENERIC
MARKING DIAGRAM*
XXXXXX = Specific Device Code
A = Assembly Location
L = Wafer Lot
Y = Year
WW = Work Week
G = Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
BOTTOM VIEW
OPTIONAL CONSTRUCTIONS
TOP VIEW
SIDE VIEW
DUAL GAUGE
BOTTOM VIEW
L
T
P
R
DETAIL C
SEATING
PLANE
2X
G
N
M
CONSTRUCTION
D
C
DETAIL C
E
OPTIONAL
CHAMFER
SIDE VIEW
SINGLE GAUGE
CONSTRUCTION
S
C
DETAIL C
TT
D
E 0.018 0.026 0.457 0.660
S
8
_
0
_
8
_
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
http://onsemi.com
1
© Semiconductor Components Industries, LLC, 2002
October, 2002 − Rev. 0
Case Outline Number:
XXX
DOCUMENT NUMBER:
STATUS:
NEW STANDARD:
DESCRIPTION:
98ASH01005A
ON SEMICONDUCTOR STANDARD
D
2
PAK
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
PAGE 1 OF 2
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